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PDF UPC2795 Data sheet ( Hoja de datos )
| Número de pieza | UPC2795 | |
| Descripción | GENERAL PURPOSE L-BAND DOWN CONVERTER | |
| Fabricantes | NEC | |
| Logotipo |  |
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2795GV
GENERAL PURPOSE L-BAND DOWN CONVERTER
DESCRIPTION
The µPC2795GV is Silicon monolithic IC designed for L-band down converter. This IC consists of double
balanced mixer, local oscillator, local oscillation buffer amplifier, IF buffer amplifier, and voltage regulator.
The package is 8-pin SSOP suitable for high-density surface mount.
FEATURES
• Wide band operation
fRF = 0.95 to 2.15 GHz
• Supply voltage
5V
• Low distortion
IM3 = 55 dBc
• Packaged in 8-pin SSOP suitable for high-density mounting
ORDERING INFORMATION
PART NUMBER
µPC2795GV-E1
PACKAGE
8-pin plastic SSOP (175 mil)
PACKAGE STYLE
Embossed tape 8 mm wide. 1 k/REEL
Pin 1 indicates pull-out direction of tape
For evaluation sample order, please contact your local NEC office. (Part number for sample order: µPC2795GV)
INTERNAL BLOCK DIAGRAM
PIN CONFIGURATION (Top View)
87
65
OSC
Buffer
OSC
REG1 IF
REG2
Buffer
MIX
12
34
1
2
3
4
1. RF input
8 2. GND
3. Vcc
4. IF out
7 5. OSC Base 2
6. OSC Collector 1
6 7. OSC Collector 2
8. OSC Base 1
5
Caution: Electro-static sensitive devices
The information in this document is subject to change without notice.
Document No. P11734EJ2V0DS00 (2nd edition)
Date Published June 1998 N CP(K)
Printed in Japan
©
1996
1 page  
STANDARD CHARACTERISTICS
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–40
Pin vs. Pout
950 MHZ
950 + 980
MHz
VCC = 5 V
fRF1 = 950 MHZ
fRF2 = 980 MHZ
fOSC = 1430 MHZ
POSC = –10 dBm
fIF = 480 MHZ
TA = 25 ˚C
–30 –20 –10
0
10
Pin - Input Power - dBm
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–40
Pin vs. Pout
950 MHZ
950 + 980
MHz
VCC = 5 V
fRF1 = 950 MHZ
fRF2 = 980 MHZ
fOSC = 1430 MHZ
POSC = –10 dBm
fIF = 480 MHZ
TA = –40 ˚C
–30 –20 –10
0
10
Pin - Input Power - dBm
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–40
Pin vs. Pout
950 MHZ
950 + 980
MHz
VCC = 5 V
fRF1 = 950 MHZ
fRF2 = 980 MHZ
fOSC = 1430 MHZ
POSC = –10 dBm
fIF = 480 MHZ
TA = 85 ˚C
–30 –20 –10
0
10
Pin - Input Power - dBm
µPC2795GV
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–40
Pin vs. Pout
2.15 GHZ
2.15 + 2.18
GHz
VCC = 5 V
fRF1 = 2.15 GHZ
fRF2 = 2.18 GHZ
fOSC = 2.63 GHZ
POSC = –10 dBm
fIF = 480 MHZ
TA = 25 ˚C
–30 –20 –10
0
10
Pin - Input Power - dBm
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–40
Pin vs. Pout
2.15 GHZ
2.15 + 2.18
GHz
VCC = 5 V
fRF1 = 2.15 GHZ
fRF2 = 2.18 GHZ
fOSC = 2.63 GHZ
POSC = –10 dBm
fIF = 480 MHZ
TA = –40 ˚C
–30 –20 –10
0
10
Pin - Input Power - dBm
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–40
Pin vs. Pout
2.15 GHZ
2.15 + 2.18
GHz
VCC = 5 V
fRF1 = 2.15 GHZ
fRF2 = 2.18 GHZ
fOSC = 2.63 GHZ
POSC = –10 dBm
fIF = 480 MHZ
TA = 85 ˚C
–30 –20 –10
0
10
Pin - Input Power - dBm
5
5 Page 
µPC2795GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to VCC line.
(5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µPC2795GV
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating
method
Soldering conditions
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Note
Number of reflow process: 3, Exposure limit : None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Note
Number of reflow process: 3, Exposure limit : None
Solder temperature: 260°C or below,
Reflow time: 10 seconds or below,
Note
Number of reflow process: 1, Exposure limit : None
Terminal temperature: 300 °C or below,
Flow time: 3 seconds or below,
Exposure limitNote: None
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet UPC2795.PDF ] | |
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