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Intersil Corporation - Octal D Flip-Flop with Reset

Numéro de référence CD54AC2733A
Description Octal D Flip-Flop with Reset
Fabricant Intersil Corporation 
Logo Intersil Corporation 





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CD54AC2733A fiche technique
SEMICONDUCTOR
June 1997
COMPLETE DATA SHEET
COMING SOON!
CD54AC273/3A
CD54ACT273/3A
Octal D Flip-Flop with Reset
Description
The CD54AC273/3A and CD54ACT273/3A are octal D flip-
flops with reset that utilize the Harris Advanced CMOS Logic
technology. Information at the D input is transferred to the Q
output on the positive-going edge of the clock pulse. All eight
flip-flops are controlled by a common clock (CP) and a com-
mon reset (MR). Resetting is accomplished by a low-voltage
level independent of the clock.
The CD54AC273/3A and CD54ACT273/3A are supplied in
20 lead dual-in-line ceramic packages (F suffix).
ACT INPUT LOAD TABLE
INPUT
UNIT LOAD (NOTE 1)
Dn 0.5
MR 0.57
CP 1
NOTE:
1. Unit load is ICC limit specified in DC Electrical Specifications
Table, e.g., 2.4mA Max at +25oC.
Functional Diagram
CLOCK
CP
D0
D1
D2
DATA D3
INPUTS D4
D5
D6
D7
RESET MR
Q0
Q1
Q2
Q3 DATA
Q4 OUTPUTS
Q5
Q6
Q7
Absolute Maximum Ratings
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current, Per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or GND Current, ICC or IGND
For Up to 4 Outputs Per Device, Add ±25mA For Each
Additional Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±100mA
Power Dissipation Per Package, PD
TA = -55oC to +100oC (Package F) . . . . . . . . . . . . . . . . . . 500mW
TA = +100oC to +125oC (Package F) . . . . . . . . Derate Linearly at
8mW/oC to 300mW
Operating Temperature Range, TA
Package Type F . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC
Storage Temperature, TSTG . . . . . . . . . . . . . . . . . . -65oC to +150oC
Lead Temperature (During Soldering)
At Distance 1/16in. ± 1/32in. (1.59mm ± 0.79mm)
From Case For 10s Max . . . . . . . . . . . . . . . . . . . . . . . . . . +265oC
Unit Inserted Into a PC Board (Min Thickness 1/16in., 1.59mm)
With Solder Contacting Lead Tips Only. . . . . . . . . . . . . . . +300oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Recommended Operating Conditions
Supply Voltage Range, VCC
Unless Otherwise Specified, All Voltages Referenced to GND
TA = Full Package Temperature Range
CD54AC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
CD54ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO. . . . . . . . . . . . . . . . . . 0V to VCC
Operating Temperature, TA . . . . . . . . . . . . . . . . . . . -55oC to +125oC
Input Rise and Fall Slew Rate, dt/dv
at 1.5V to 3V (AC Types) . . . . . . . . . . . . . . . . . . . 0ns/V to 50ns/V
at 3.6V to 5.5V (AC Types) . . . . . . . . . . . . . . . . . 0ns/V to 20ns/V
at 4.5V to 5.5V (AC Types) . . . . . . . . . . . . . . . . . 0ns/V to 10ns/V
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper I.C. Handling Procedures.
Copyright © Harris Corporation 1994
1
File Number 3904

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