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PDF PZTA92T1 Data sheet ( Hoja de datos )
| Número de pieza | PZTA92T1 | |
| Descripción | High Voltage Transistor | |
| Fabricantes | ON Semiconductor | |
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ON Semiconductort
High Voltage Transistor
PNP Silicon
COLLECTOR 2,4
PZTA92T1
ON Semiconductor Preferred Device
MAXIMUM RATINGS
Rating
Symbol
BASE
1
EMITTER 3
Value
Unit
SOT–223 PACKAGE
PNP SILICON
HIGH VOLTAGE TRANSISTOR
SURFACE MOUNT
Collector–Emitter Voltage
Collector–Base Voltage
Emitter–Base Voltage
Collector Current
Total Power Dissipation up to TA = 25°C(1)
Storage Temperature Range
Junction Temperature
DEVICE MARKING
VCEO
VCBO
VEBO
IC
PD
Tstg
TJ
–300
–300
–5.0
–500
1.5
–65 to +150
150
Vdc
Vdc
Vdc
mAdc
Watts
°C
°C
4
1
2
3
CASE 318E–04, STYLE 1
TO–261AA
P2D
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance from Junction to Ambient(1)
RθJA
83.3
°C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage (IC = –100 µAdc, IE = 0)
Emitter–Base Breakdown Voltage (IE = –100 µAdc, IC = 0)
Collector–Base Cutoff Current (VCB = –200 Vdc, IE = 0)
Emitter–Base Cutoff Current (VBE = –3.0 Vdc, IC = 0)
ON CHARACTERISTICS
V(BR)CEO
V(BR)CBO
V(BR)EBO
ICBO
IEBO
–300
–300
–5.0
—
—
—
—
—
–0.25
–0.1
Vdc
Vdc
Vdc
µAdc
µAdc
DC Current Gain(2)
(IC = –1.0 mAdc, VCE = –10 Vdc)
(IC = –10 mAdc, VCE = –10 Vdc)
(IC = –30 mAdc, VCE = –10 Vdc)
Saturation Voltages
(IC = –20 mAdc, IB = –2.0 mAdc)
(IC = –20 mAdc, IB = –2.0 mAdc)
DYNAMIC CHARACTERISTICS
hFE
VCE(sat)
VBE(sat)
—
25 —
40 —
25 —
Vdc
— –0.5
— –0.9
Collector–Base Capacitance @ f = 1.0 MHz (VCB = –20 Vdc, IE = 0)
Ccb — 6.0 pF
Current–Gain — Bandwidth Product
(IC = –10 mAdc, VCE = –20 Vdc, f = 100 MHz)
fT 50 — MHz
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2.
2. Pulse Test: Pulse Width ≤ 300 µs; Duty Cycle = 2.0%.
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 4
1
Publication Order Number:
PZTA92T1/D
1 page  
PZTA92T1
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 6 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can affect
the profile include the type of soldering system in use,
density and types of components on the board, type of solder
used, and the type of board or substrate material being used.
This profile shows temperature versus time. The line on the
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177–189°C.
When this type of furnace is used for solder reflow work, the
circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction. The
circuit board, because it has a large surface area, absorbs the
thermal energy more efficiently, then distributes this energy
to the components. Because of this effect, the main body of
a component may be up to 30 degrees cooler than the
adjacent solder joints.
200°C
STEP 1 STEP 2 STEP 3
STEP 4
STEP 5 STEP 6 STEP 7
PREHEAT VENT HEATING
HEATING HEATING VENT COOLING
ZONE 1
RAMP"
SOAK" ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7
RAMP"
SOAK"
SPIKE"
205° TO
219°C
DESIRED CURVE FOR HIGH
170°C
PEAK AT
MASS ASSEMBLIES
160°C
SOLDER
150°C
JOINT
150°C
100°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 6. Typical Solder Heating Profile
http://onsemi.com
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| PDF Descargar | [ Datasheet PZTA92T1.PDF ] | |
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