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PDF RND02ZGE-M6 Data sheet ( Hoja de datos )
| Número de pieza | RND02ZGE-M6 | |
| Descripción | RND Series: 8-10W DC/DC Converters 38-75V Input 3.3V & 5.0V/ 12V Dual Outputs 15V/ available with trimming | |
| Fabricantes | Power-One | |
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Product Specifications
RND Series: 8-10W DC/DC Converters
Nov 2001
38-75V Input
3.3V & 5.0V, ±12V Dual Outputs (±15V, available with trimming)
Features
Applications
• Distributed power architectures
• Telecommunications equipment
• LAN/WAN applications
• Data processing
Description
• Single board design
• Synchronization function
• Low profile – 8.5 mm height
• Excellent co-planarity
• Input/output isolation: 1500 Vdc
• Convection cooling
• Low conducted and radiated EMI
• Output overcurrent protection
• Remote on/off (primary referenced)
• Wide output voltage trim adjust, positive or
negative
• Operating temperature to 110°C
• UL, CSA and EN/IEC60950 (3rd ed.) approved
The RND series of converters are industry standard, 2” x 1” size, low profile, dual output, DC/DC converters
intended for SMT placement and reflow soldering. The product provides on-board conversion of standard
telecom, datacom and industrial input voltages to isolated low output voltages without the need for any
additional cooling. Proprietary patented manufacturing process ensures optimal quality through full process
automation. The converters are cost effective high performance alternatives to competing products on the
market.
Model
RND02ZGE-M6
RND0.8ZHH-M6
Input voltage
range,
Vdc
38-75
36-75
Selection Chart
Input
Output Output rated
current, voltage, current,
max Adc Vdc
Adc
0.4
3.27
5.20
1.0
1.0
0.4
12.0
12.0
0.42
0.42
Output ripple
and noise,
mVp-p
50
50
50
50
Efficiency,
%
81
85
5-Nov-01
Rev 1.1
www.power-one.com
Page 1 of 14
1 page  
Product Specifications
RND Series: 8-10W DC/DC Converters
Nov 2001
38-75V Input
3.3V & 5.0V, ±12V Dual Outputs (±15V, available with trimming)
Output Specifications
All specifications apply over input voltage, output load and temperature range, unless otherwise noted.
RND0.8ZHH: (Vo1) +12.0V/0.42A
Parameter
Output Voltage
Setpoint Accuracy
Output Current *
Line Regulation
Load Regulation
Cross Regulation
Dynamic Regulation
Peak Deviation
Settling Time
Output Voltage Ripple
Admissible Load Cap.
Output Current Limit
Threshold
Switching Frequency
Temperature Coeff.
Trim Range
Conditions/Description
Vo Vin.Nom, Io = 0.3A, 25°C
Io
Vr
Comax
Icl
Fs
Tco
Vt
Vin.Min to Vin.Max
Vin.Min to Vin.Max, 50%
Io.Max
Vin.Nom, Io.Min to Io.Max
Io1 = 0.42A, Io2 Min to Max,
measure ∆Vo2
25-75% Io.Max load step
change.
to 1% error band
Vin.Min to Vin.Max, Io.Min to
Io Max, 20MHz Bandwidth
Io.Max, Vin.Nom
Vout ≤0.90 Vo.Nom, both
outputs set to Icl
Vin.Nom, Io.Max
Io.Min to Io.Max, Vin.Min to
Vin.Max
Min
11.82
0.042
110
9.0
Nom
12.00
100
40
400
Max
12.18
0.42
90
170
60
Units
Vdc
Adc
mV
mV
mV
400 ± mV
300 µs
100 mVp-p
100**
µF
150 %Io.Max
kHz
0.02 %Vo/°C
15.0 Vo
RND0.8ZHH: (Vo2) -12.0V/0.42A
Parameter
Conditions/Description
Min Nom Max
Units
Output Voltage
Setpoint Accuracy
Vo
Vin.Nom, Io = 0.3A, 25°C -11.82 -12.00 -12.18
Vdc
Output Current *
Io
Vin.Min to Vin.Max
0.042
0.42 Adc
Line Regulation
Vin.Min to Vin.Max, 50%
90 mV
Io.Max
Load Regulation
Vin.Nom, Io.Min to Io.Max
100 170
mV
Cross Regulation
Io1 = 0.42A, Io2 Min to Max,
60 mV
measure ∆Vo2
Dynamic Regulation
25-75% Io.Max load step
Peak Deviation
change.
400 ± mV
Settling Time
to 1% error band
300 µs
Output Voltage Ripple
Vr Vin.Min to Vin.Max, Io.Min to
40 100 mVp-p
Io Max, 20MHz Bandwidth
Admissible Load Cap. Comax
Io.Max, Vin.Nom
100**
µF
Output Current Limit
Icl
Vout ≤0.90 Vo.Nom, both
110
150 %Io.Max
Threshold
outputs set to Icl
Switching Frequency
Fs
Vin.Nom, Io.Max
400 kHz
Temperature Coeff.
Tco
0.02 %Vo/°C
Trim Range
Vt Io.Min to Io.Max, Vin.Min to -9.0
-15.0
Vo
Vin.Max
* At Iout<Iout.Min, the output may contain low frequency component that exceeds ripple specifications.
** 100µF on each output
5-Nov-01
Rev 1.1
www.power-one.com
Page 5 of 14
5 Page 
Product Specifications
RND Series: 8-10W DC/DC Converters
Nov 2001
38-75V Input
3.3V & 5.0V, ±12V Dual Outputs (±15V, available with trimming)
Surface Mount Assembly
Soldering:
The following instructions must be observed when
soldering the unit. Failure to observe these
instructions may result in failure or significant
degradation of the module performance. Power-
One will not honor any warranty claims arising
from failure to observe these instructions.
This product is approved for forced convection
reflow soldering only.
The curves below define the maximum peak
reflow temperature permissible measured on
Pins 1 and 10 of the converter.
.
Max. temp. on pins 1 and 10 during reflow
soldering (deg C)
300 Peak Temperature
(See fig below)
250
200
150 tp
100
50
0
190 – 450 s
Time (s)
The lead-frame is constructed for a high
temperature glass filled, UL94V0 flame retardant,
diallyl ortho-phthalate moulding compound
commonly used for packaging of electronics
components. It has passed NASA outgassing
tests and is certified to MIL-M-14. The coefficient
of thermal expansion is equivalent to FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore
they facilitate visual inspection (manual or
automatic). The leads are formed from a 97% Cu
alloy plated with Cu and Sn 90. This material is
commonly used in the manufacture of integrated
circuits. It has good corrosion resistance and
exhibits the nobility inherent to all high copper
alloys. Unlike brasses, this material is essentially
immune to stress corrosion cracking. It also
exhibits excellent solderability. It is readily
wetted by solders and performs well in standard
solderability tests. (Dip of Class II or better).
The product is manufactured with a patented
process, which is fully automated, and ‘in-line’.
This ensures that there is no contamination or
mechanical stress on the lead-frame so that the
co planarity and solderability are maintained.
The product is shipped in JEDEC trays to
guarantee preservation of the co-planarity and
enable fully automated assembly in the final
application.
Restriction curve above 215ºC
Peak temp. at pins 1 and 10 (ºC)
245
240
235
230
225
220
215
210
205
200
10 20 30 40 50 60
tp (s)
Pick & Place Assembly:
The product is designed with a large flat area in
the center of the top surface to serve as a pick up
point for automated vacuum pick and place
equipment. The ‘open board’ construction of the
unit ensures that weight is kept to a minimum.
However due to the relatively large size of the
component, a large nozzle (> 4.0mm, depending
on vacuum pressure) is recommended for picking
and placing.
The unit may also be automatically handled using
‘odd-form’ placement equipment, with mechanical
grippers. For this type of equipment the end
edges of the device, which have no leads and
also feature the greatest dimensional accuracy,
should be used as pick-up points.
5-Nov-01
Rev 1.1
www.power-one.com
Page 11 of 14
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet RND02ZGE-M6.PDF ] | |
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