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PDF TDA8579T Data sheet ( Hoja de datos )

Número de pieza TDA8579T
Descripción Dual common-mode rejection differential line receiver
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TDA8579T
Dual common-mode rejection differential line receiver
Rev. 4 — 23 September 2013
Product data sheet
1. General description
The TDA8579T is a two channel differential amplifier with 0 dB gain and low distortion.
The device has been primarily developed for car radio applications where long
connections between signal sources and amplifiers (or boosters) are necessary and
where ground noise has to be eliminated. The device is intended to be used to receive line
inputs in audio applications that require a high level of common-mode rejection. The
device is contained in an 8-pin Small Outline (SO) package.
2. Features and benefits
Excellent common-mode rejection, up to high frequencies
Elimination of source resistance dependency in the common-mode rejection
Few external components
High supply voltage ripple rejection
Low noise
Low distortion
All pins protected against electrostatic discharge
AC and DC short-circuit safe to ground and VCC
Fast DC settling
3. Quick reference data
Table 1.
Symbol
VCC
ICC
GV
SVRR
Vno
|Zi|
CMRR
Quick reference data
Parameter
supply voltage
supply current
voltage gain
supply voltage ripple rejection
noise output voltage
input impedance
common-mode rejection ratio
Conditions
VCC = 8.5 V
Rs = 0
Min Typ Max Unit
5.0 8.5 18 V
- 11 14 mA
0.5 0 +0.5 dB
55 60 -
dB
- 3.7 5.0 V
100 240 -
k
- 80 -
dB

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TDA8579T pdf
NXP Semiconductors
TDA8579T
Dual common-mode rejection differential line receiver
10. Characteristics
Table 6. Electrical characteristics
VCC = 8.5 V; Tamb = 25 C; test circuit (see Figure 3); unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
VCC supply voltage
ICC supply current
VO output voltage
tset DC input voltage settling time
Gv voltage gain
cs channel separation
|Gv| channel unbalance
fL LOW frequency roll-off
fH HIGH frequency roll-off
|Zi| input impedance
|Zo| output impedance
Vi(max) maximum input voltage
Vno noise output voltage
VCM(rms) common-mode input voltage
(RMS value)
Rs = 5 k
1 dB
1 dB
THD = 1 %
Rs = 0
5.0
-
[1] -
-
0.5
70
-
[2] 20
20
100
-
-
[3] -
-
8.5
11
4.3
0.2
0
80
-
-
-
240
-
2.0
3.7
-
CMRR
SVRR
common-mode rejection ratio
supply voltage ripple rejection
Rs = 5 k
Rs = 0
66
[4] -
[5] 55
70
80
65
[6] -
60
THD total harmonic distortion
Vi = 1 V;
- 0.02
Vi = 1 V;
--
f = 20 Hz to 20 kHz
THDmax total harmonic distortion at
maximum output current
Vi = 1 V; RL = 150
-
-
Max
18
14
-
-
+0.5
-
0.5
-
-
-
10
-
5.0
1.0
-
-
-
-
-
0.1
1
Unit
V
mA
V
s
dB
dB
dB
Hz
kHz
k
V
V
V
dB
dB
dB
dB
%
%
%
[1] The DC output voltage with respect to ground is approximately 0.5VCC.
[2] The input coupling capacitors set the frequency response externally.
[3] The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
[4] The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in
accordance with the test circuit (see Figure 3). VINL and VINR are short-circuited. Frequencies are between
100 Hz and 100 kHz.
[5] The ripple rejection is measured at the output, with Rs = 2 k, f = 1 kHz and a ripple amplitude of 2 V (p-p).
[6] The ripple rejection is measured at the output. Rs = 0 to 2 k, f = 100 Hz to 20 kHz and a maximum
ripple amplitude of 2 V (p-p).
TDA8579T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 23 September 2013
© NXP B.V. 2013. All rights reserved.
5 of 16

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TDA8579T arduino
NXP Semiconductors
TDA8579T
Dual common-mode rejection differential line receiver
13. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
TDA8579T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 23 September 2013
© NXP B.V. 2013. All rights reserved.
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