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PDF TDA8012M Data sheet ( Hoja de datos )
| Número de pieza | TDA8012M | |
| Descripción | Low power PLL FM demodulator for satellite TV receivers | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA8012M
Low power PLL FM demodulator
for satellite TV receivers
Product specification
Supersedes data of 1995 Feb 02
File under Integrated Circuits, IC02
1996 Mar 26
1 page  
Philips Semiconductors
Low power PLL FM demodulator
for satellite TV receivers
Product specification
TDA8012M
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
VCC
Vi(max)
Isource(max)
tsc
ZL
Tstg
Tj
Tamb
supply voltage
maximum input voltage on all pins
maximum output source current
maximum short-circuit time on all outputs
AC load impedance at video output
storage temperature
junction temperature
operating ambient temperature
MIN.
−0.3
−0.3
−
−
600
−55
−
−10
MAX.
6.0
VCC
10
10
−
+150
+150
+80
UNIT
V
V
mA
s
Ω
°C
°C
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-a
thermal resistance from junction to ambient in free air
VALUE
120
UNIT
K/W
CHARACTERISTICS
VCC = 5 V; fi = 480 MHz; Vi = 57 dBµV; Tamb = 25 °C; measured in application circuit of Fig.4;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Supplies
VCC supply voltage
ICC supply current
note 1
Voltage controlled oscillator
KVCO
δfo/δT
∆fo
voltage controlled oscillator constant VCC = 4.75 to 5.25 V;
Tamb = −10 το +80 °C
voltage controlled oscillator drift
note 2
voltage controlled oscillator shift
VCC = 4.75 to 5.25 V
Frequency demodulator
Vi input signal voltage level
Zi input impedance
note 3
real part; note 4
parallel inductive part;
note 4
KPD phase detector constant
Gv phase-lock loop gain
Vi = 57 dBµV
drift; note 5
shift; note 5
4.75
50
22.5
−
−
53
−
−
−
−
−
5.0 5.25 V
60 70 mA
25 27.5
−70 × 10−6 −
− ±750
MHz/V
°C−1
kHz
57 61 dBµV
50 − Ω
130 − nH
0.37 − V/rad
2 − dB
2 − dB
1996 Mar 26
5
5 Page 
Philips Semiconductors
Low power PLL FM demodulator
for satellite TV receivers
Product specification
TDA8012M
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SSOP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Mar 26
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet TDA8012M.PDF ] | |
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