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PDF TDA8004T Data sheet ( Hoja de datos )
| Número de pieza | TDA8004T | |
| Descripción | IC card interface | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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INTEGRATED CIRCUITS
DATA SHEET
TDA8004T
IC card interface
Product specification
Supersedes data of 1997 Nov 21
File under Integrated Circuits, IC02
1999 Dec 30
1 page  
Philips Semiconductors
IC card interface
Product specification
TDA8004T
PINNING
SYMBOL
CLKDIV1
CLKDIV2
RFU1
PGND
S2
VDDP
S1
VUP
PRES
PRES
I/O
AUX2
AUX1
CGND
CLK
RST
VCC
n.c.
CMDVCC
RSTIN
VDD
GND
OFF
XTAL1
XTAL2
I/OUC
AUX1UC
AUX2UC
PIN I/O
DESCRIPTION
1 I control with CLKDIV2 for choosing CLK frequency
2 I control with CLKDIV1 for choosing CLK frequency
3 I reserved for future use (to be connected to VDD or microcontroller I/O; active HIGH)
4 supply power ground for step-up converter
5 I/O capacitance connection for step-up converter (a 100 nF capacitor with ESR < 100 mΩ
must be connected between pins S1 and S2)
6 supply power supply voltage for step-up converter
7 I/O capacitance connection for step-up converter (a 100 nF capacitor with ESR < 100 mΩ
must be connected between pins S1 and S2)
8 I/O output of step-up converter (a 100 nF capacitor with ESR < 100 mΩ must be
connected to PGND)
9 I card presence contact input (active LOW); if PRES or PRES is true, then the card is
considered as present
10 I card presence contact input (active HIGH); if PRES or PRES is true, then the card is
considered as present
11 I/O data line to and from card (C7) (internal 10 kΩ pull-up resistor connected to VCC)
12 I/O auxiliary line to and from card (C8) (internal 10 kΩ pull-up resistor connected to VCC)
13 I/O auxiliary line to and from card (C4) (internal 10 kΩ pull-up resistor connected to VCC)
14 supply ground for card signals
15 O clock to card (C3)
16 O card reset (C2)
17 O Supply for card (C1); decouple to CGND with 2 × 100 nF or 1 × 100 nF and 1 × 220 nF
capacitors with ESR < 100 mΩ (with 220 nF, the noise margin on VCC will be higher).
18 − not connected
19 I start activation sequence input from microcontroller (active LOW)
20 I card reset input from microcontroller (active HIGH)
21 supply supply voltage
22 supply ground
23 O NMOS interrupt to microcontroller (active LOW) with 20 kΩ internal pull-up resistor
connected to VDD (refer section “Fault detection”)
24 I crystal connection or input for external clock
25 O crystal connection (leave open if an external clock source is used)
26 I/O microcontroller data I/O line (internal 10 kΩ pull-up resistor connected to VDD)
27 I/O auxiliary line to and from microcontroller (internal 10 kΩ pull-up resistor connected to
VDD)
28 I/O auxiliary line to and from microcontroller (internal 10 kΩ pull-up resistor connected to
VDD)
1999 Dec 30
5
5 Page 
Philips Semiconductors
IC card interface
Product specification
TDA8004T
handbook, full pagewidth
PRES
OFF
CMDVCC
VCC
Deactivation caused by
cards withdrawal
Deactivation caused by
short circuit
FCE271
Fig.7 Behaviour of OFF, CMDVCC, PRES and VCC.
handbook, full pagewidth
OSC_INT/64
(T ≈ 25 µs)
OFF
PRES
VCC
I/O
CLK
RST
tde
t10
t14
t13
high - Z
t12
t11
MGE740
Fig.8 Emergency deactivation sequence.
VCC regulator
VCC buffer is able to deliver up to 65 mA continuously. It has an internal overload detection at approximately 90 mA.
This detection is internally filtered, allowing spurious current pulses up to 200 mA to be drawn by the card without causing
a deactivation (the average current value must stay below 65 mA).
For VCC accuracy reasons, a 100 nF capacitor with ESR < 100 mΩ should be tied to CGND near pin 17 and a 100 nF
(or better 220 nF) with same ESR should be tied to CGND near C1 contact.
1999 Dec 30
11
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet TDA8004T.PDF ] | |
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