(PDF) V23814-Z6-Z1 Datasheet - Heatsink for PAROLI Backplane Module

Número de pieza	V23814-Z6-Z1
Descripción	Heatsink for PAROLI Backplane Module
Fabricantes	Infineon Technologies
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No Preview Available ! Heatsink for PAROLI® Backplane Module Fiber Optics V23814-Z6-Z1 1 General Scope This data sheet describes the detachable heatsink for PAROLI® Backplane module V23814-x1306-M1331) (transmitter) resp. V23815-x1306-M1331) (receiver). 2 Technical Data See Figure 1. Dimensions Material Coefficient of thermal conduction No. of fins 45 x 24 x 8.75±0.2 mm (L x W x H) Al Mg 4.5 Mn, black anodized 110…140 W m–1 K–1 14 (1.4 mm width) 3 Application and Assembly Application is the use of the heatsink to attach onto the module baseplate. For optimized heat transfer between module and heatsink Infineon recommends to use a heat dissipation foil between both parts (e.g. Panasonic PGS 0.1 mm thickness). Dimensions see Figure 2. The fixing is done by two screws. Recommendation for screw dimensions: ISO 7045 - M1.6 x 6 - A2 50 - H. The screws have to be fixed with 10 Ncm. 1) x = K for 1.25 Gbit/s x = U for 1.6 Gbit/s x = Q for 2.7 Gbit/s PAROLI® is a registered trademark of Infineon Technologies Data Sheet 1 2003-07-25 1 page

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