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PDF UPG173TA-E3 Data sheet ( Hoja de datos )
| Número de pieza | UPG173TA-E3 | |
| Descripción | L-BAND PA DRIVER AMPLIFIER | |
| Fabricantes | NEC | |
| Logotipo |  |
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PRELIMINARY DATA SHEET
GaAs INTEGRATED CIRCUIT
PPG173TA
L-BAND PA DRIVER AMPLIFIER
DESCRIPTION
The PPG173TA is L-Band PA driver amplifier developed for digital cellular telephone and PCS applications. This
device feature high output power and low distortion with 2.8 V low voltage and 25 mA low current operation. It is
housed in a very small 6 pin mini-mold package available on tape-and-reel and easy to install and contributes to
miniaturizing the systems.
FEATURES
{ Low Operation Voltage : VDD = 2.8 V
{ Low distortion
: Padj 1 = –60 dBc typ. @ VDD = 2.8 V, fRF = 925 to 960 MHz, Pout = +9 dBm
External output matching
{ Low operation Current : IDD = 25 mA typ. @ VDD = 2.8 V, fRF = 925 to 960 MHz, Pout = +9 dBm
External output matching
{ 6 pin mini-mold package
APPLICATION
{ Digital Cellular: PDC, GSM, IS-95, IS-136, PCS etc.
ORDERING INFORMATION
PART NUMBER
PPG173TA-E3
PACKAGE
6 pin Mini-Mold
PACKING FORM
Carrier tape width is 8 mm, Quantity is 3 kpcs per reel.
Remark For sample order, please contact your local NEC sales office. (Part number for sample order:
PPG173TA)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
PARAMETERS
Supply Voltage
Input Power
Total Power Dissipation
Operating Temperature
Storage Temperature
SYMBOL
VDD
Pin
Ptot
TA
Tstg
RATINGS
6.0
–8
170Note
–30 to +90
–35 to +150
UNIT
V
dBm
mW
°C
°C
Note Mounted on a 50 u 50 u 1.6 mm double copper clad epoxy glass PWB, TA = +85°C
Caution The IC must be handled with care to prevent static discharge because its circuit composed of
GaAs HJ-FET.
The information in this document is subject to change without notice.
Document No. P13059EJ1V0DS00 (1st edition)
Date Published November 1997 N
Printed in Japan
© 1997
1 page  
PPG173TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Infrared ray reflow
VPS
Wave Soldering
Pin part heating
Soldering conditions
Package peak temperature: 235°C
Hour: within 30 s. (more than 210°C)
Time: 3 times, Limited days: no.Note
Package peak temperature: 215°C
Hour: within 40 s. (more than 200°C)
Time: 3 times, Limited days: no.Note
Soldering tub temperature: less than 260°C, Hour: within 10 s.
Time: 1 time, Limited days: no.Note
Pin area temperature: less than 300°C, Hour: within 3 s.
Limited days: no.Note
Recommended condition
symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet
5
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