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Microsemi Corporation - SURFACE MOUNT P . CHANNEL MOSKEY

Numéro de référence UPFS320P
Description SURFACE MOUNT P . CHANNEL MOSKEY
Fabricant Microsemi Corporation 
Logo Microsemi Corporation 





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UPFS320P fiche technique
# 580 Pleasant Street
Watertown, MA 02472
Phone:(617) 926-0404
F A X : (617) 924-1235
UPFS320P
Features
POWERMITE 3 Surface Mount Package
MOSFET with Schottky Rectifier for reverse voltage blocking
Single 3 leaded device replaces 2 individual components
Integral Heat Sink / Locking Tabs
Supplied in 16mm Tape and Reel – 6000 units/reel
Superior Low Thermal and Electrical capability
Mechanical Characteristics
Footprint Area of 16.51 mm2
Case: Molded Epoxy
Meets UL94VO at 1/8 inch
Weight: 72 milligrams
Lead and Mounting Temperatures: 260°C max for 10 seconds
Description
The MOSKEYcombines a MOSFET with a Schottky Recti-
fier to provide reverse blocking capability in a single three
leaded package. This device is well suited for applications
such as battery chargers and switching where the intrinsic
source-drain diode is an undesirable feature.
SURFACE MOUNT
P – CHANNEL
MOSKEY
Absolute Maximum Ratings at 25°C
Note: Vks = Vds (Mosfet) + Vf (Rectifier)
RATING
Cathode-to-Source Voltage
Gate-to-Source Voltage
Cathode Current:
Continuous @ TA=25°C
Single Pulsed
Total Power Dissipation
Storage Temperature
Operating Temperature
SYMBOL
VKSS
VGS
IK
IKM
PD (1)
T stg
T op
VALUE
+/- 20
+/- 8
3.0
11.0
2.0
-55 to 150°C
-55 to 150°C
UNIT
Vdc
Vdc
Adc
Apk
Watts
C
C
Thermal Characteristics
Thermal Resistance:
Junction to Tab
(1)Junction-to-tab
(2)Junction-to-ambient
Rjtab
Rja (1)
Rja (2)
5
60
120
°C/Watt
°C/Watt
°C/Watt
(1) Mounted on 2” square by 0.06’ thick FR4 board with a 1” x1” square 2 ounce copper pattern.
(2) Mounted on 0.06 thick FR4 board, using recommended footprint, with 2 ounce copper
MSC 02-17-00
PRELIMINARY

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