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PDF VND05BSP Data sheet ( Hoja de datos )

Número de pieza VND05BSP
Descripción ISO HIGH SIDE SMART POWER SOLID STATE RELAY
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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® VND05BSP
ISO HIGH SIDE SMART POWER SOLID STATE RELAY
TYPE
VND05BSP
VDSS
40 V
RDS(on)
0.2
IOUT
1.6 A
VCC
26 V
s OUTPUT CURRENT (CONTINUOUS):
9A @ Tc = 85oC PER CHANNEL
s 5V LOGIC LEVEL COMPATIBLE INPUT
s THERMAL SHUT-DOWN
s UNDER VOLTAGE PROTECTION
s OPEN DRAIN DIAGNOSTIC OUTPUT
s INDUCTIVE LOAD FAST
DEMAGNETIZATION
s VERY LOW STAND-BY POWER
DISSIPATION
DESCRIPTION
The VND05BSP is a monolithic device made
using STMicroelectronics VIPower Technology,
intended for driving resistive or inductive loads
with one side grounded. This device has two
channels, and a common diagnostic. Built-in
thermal shut-down protects the chip from over
temperature and short circuit.
The status output provides an indication of open
load in on state, open load in off state,
overtemperature conditions and stuck-on to VCC.
BLOCK DIAGRAM
10
1
PowerSO-10
April 2001
1/9

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VND05BSP pdf
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Switching Time Waveforms
VND05BSP
FUNCTIONAL DESCRIPTION
The device has a diagnostic output which
indicates open load in on-state, open load in
off-state, over temperature conditions and
stuck-on to VCC.
From the falling edge of the input signal, the
status output, initially low to signal a fault
condition (overtemperature or open load
on-state), will go back to a high state with a
different delay in case of overtemperature (tpovl)
and in case of open open load (tpol) respectively.
This feature allows to discriminate the nature of
the detected fault. To protect the device against
short circuit and over current condition, the
thermal protection turns the integrated Power
MOS off at a minimum junction temperature of
140 oC. When this temperature returns to 125 oC
the switch is automatically turned on again. In
short circuit the protection reacts with virtually no
delay, the sensor being located inside the Power
MOS area. An internal function of the devices
ensures the fast demagnetization of inductive
loads with a typical voltage (Vdemag) of -18V. This
function allows to greatly reduces the power
dissipation according to the formula:
Pdem = 0.5 Lload •(Ιload)2 [(VCC+Vdemag)/Vdemag]
f
where f = switching frequency and
Vdemag = demagnetization voltage.
The maximum inductance which causes the chip
temperature to reach the shut-down temperature
in a specified thermal environment is a function of
the load current for a fixed VCC, Vdemag and f
according to the above formula. In this device if
the GND pin is disconnected, with VCC not
exceeding 16V, it will switch off.
PROTECTING THE DEVICE AGAINST
REVERSE BATTERY
The simplest way to protect the device against a
continuous reverse battery voltage (-26V) is to
insert a Schottky diode between pin 1 (GND) and
ground, as shown in the typical application circuit
(fig.3).
The consequences of the voltage drop across this
diode are as follows:
If the input is pulled to power GND, a negative
voltage of -Vf is seen by the device. (Vil, Vih
thresholds and Vstat are increased by Vf with
respect to power GND).
The undervoltage shutdown level is increa- sed
by Vf.
If there is no need for the control unit to handle
external analog signals referred to the power
GND, the best approach is to connect the
reference potential of the control unit to node [1]
(see application circuit in fig. 3), which becomes
the common signal GND for the whole control
board avoiding shift of Vih, Vil and Vstat. This
solution allows the use of a standard diode.
5/9

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