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IRF520VS fiches techniques PDF

International Rectifier - Power MOSFET(Vdss=100V/ Rds(on)=0.165ohm/ Id=9.6A)

Numéro de référence IRF520VS
Description Power MOSFET(Vdss=100V/ Rds(on)=0.165ohm/ Id=9.6A)
Fabricant International Rectifier 
Logo International Rectifier 





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IRF520VS fiche technique
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Optimized for SMPS Applications
G
Description
Advanced HEXFET® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve extremely low on-
resistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of applications.
PD - 94306
IRF520VS
IRF520VL
HEXFET® Power MOSFET
D
VDSS = 100V
RDS(on) = 0.165
ID = 9.6A
S
The D2Pak is a surface mount power package capable of accommodating
die sizes up to HEX-4. It provides the highest power capability and the
lowest possible on-resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRF520VL) is available for low-profile applications.
D2Pak
IRF520VS
TO-262
IRF520VL
Absolute Maximum Ratings
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
VGS
IAR
EAR
dv/dt
TJ
TSTG
Parameter
Continuous Drain Current, VGS @ 10V ‡
Continuous Drain Current, VGS @ 10V ‡
Pulsed Drain Current ‡
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ƒ‡
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
9.6
6.8
37
44
0.29
± 20
9.2
4.4
7.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W/°C
V
A
mJ
V/ns
°C
Thermal Resistance
RθJC
RθJA
Parameter
Junction-to-Case
Junction-to-Ambient (PCB Mounted, steady state)**
www.irf.com
Typ.
–––
–––
Max.
3.4
40
Units
°C/W
1
01/18/02

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