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K7R323684M-FC20 fiches techniques PDF

Samsung semiconductor - 1Mx36 & 2Mx18 QDRTM II b4 SRAM

Numéro de référence K7R323684M-FC20
Description 1Mx36 & 2Mx18 QDRTM II b4 SRAM
Fabricant Samsung semiconductor 
Logo Samsung semiconductor 





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K7R323684M-FC20 fiche technique
K7R323684M
K7R321884M
Document Title
1Mx36-bit, 2Mx18-bit QDRTM II b4 SRAM
1Mx36 & 2Mx18 QDRTM II b4 SRAM
Revision History
Rev. No.
History
0.0 1. Initial document.
0.1 1. Package dimension modify.
P.20 from 13mmx15mm to 15mmx17mm
0.2 1. Pin name change from DLL to Doff.
2. Vddq range change from 1.5V to 1.5V~1.8V.
3. Update JTAG test conditions.
4. Reserved pin for high density name change from NC to Vss/SA
5. Delete AC test condition about Clock Input timing Reference Level
6. Delete clock description on page 2 and add HSTL I/O comment
0.3 1. Update current characteristics in DC electrical characteristics
2. Change AC timing characteristics
3. Update JTAG instruction coding and diagrams
0.4 1. Add -FC25 part(AC Characteristics)
2. Add AC electrical characteristics.
3. Change AC timing characteristics
4. Change DC electrical characteristics(ISB1)
0.5 1. Change the data Setup/Hold time.
2. Change the Access Time.(tCHQV, tCHQX, etc.)
3. Change the Clock Cycle Time.(MAX value of tKHKH)
4. Change the JTAG instruction coding.
0.6 1. Change the Boundary scan exit order.
2. Change the AC timing characteristics(-25, -20)
3. Correct the Overshoot and Undershoot timing diagrams.
0.7 1. Change the JTAG Block diagram
0.8 1. Correct the JTAG ID register definition
2. Correct the AC timing parameter (delete the tKHKH Max value)
3. Change the Isb1 current
0.9 1. Change the Maximum Clock cycle time.
2. Correct the 165FBGA package ball size.
1.0 1. Final spec release
2.0 1. Delete the x8 Org. part
Draft Date
June 30, 2001
Oct. 20, 2001
Remark
Advance
Advance
Dec. 5, 2001
Preliminary
July, 29. 2002
Preliminary
Sep. 6. 2002
Preliminary
Oct. 7. 2002
Preliminary
Dec. 16, 2002
Preliminary
Dec. 26, 2002
Mar. 20, 2003
Preliminary
Preliminary
April. 4, 2003
Aug. 28, 2003
Dec. 1, 2003
Preliminary
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
- 1 - Dec. 2003
Rev 2.0

PagesPages 18
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