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Samsung semiconductor - 512Kx36 & 1Mx18 Pipelined NtRAM

Numéro de référence K7N163601
Description 512Kx36 & 1Mx18 Pipelined NtRAM
Fabricant Samsung semiconductor 
Logo Samsung semiconductor 





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K7N163601 fiche technique
K7N163601A
K7N161801A
512Kx36 & 1Mx18 Pipelined NtRAMTM
Document Title
512Kx36 & 1Mx18-Bit Pipelined NtRAMTM
Revision History
Rev. No.
History
0.0 1. Initial document.
0.1 1. Add JTAG Scan Order
0.2 1. Add x32 org and industrial temperature .
2. Add 165FBGA package
0.3 1. Speed bin merge.
From K7N1636(32/18)09A to K7N1636(32/18)01A.
2. AC parameter change.
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
1.0 1. Final spec release.
2.0 1. Release Icc on page 14.
part #
-25
-22
-20
-16
-13
From
440
400
370
340
280
To
470
430
400
350
290
2.1 1. Delete 119BGA package.
2. Correct the Ball Size of 165 FBGA.
3.0 1. Delete x32 Org.
2. Delete the 225MHz speed bin
Draft Date
Remark
March. 21. 2001 Preliminary
May. 10. 2001 Preliminary
Aug. 30. 2001 Preliminary
Dec. 26. 2001 Preliminary
May. 10 .2002
May. 22. 2002
Final
Final
April. 04. 2003 Final
Nov. 17, 2003 Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
- 1 - Nov. 2003
Rev 3.0

PagesPages 24
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