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K7D803671B-HC30 fiches techniques PDF

Samsung semiconductor - 256Kx36 & 512Kx18 SRAM

Numéro de référence K7D803671B-HC30
Description 256Kx36 & 512Kx18 SRAM
Fabricant Samsung semiconductor 
Logo Samsung semiconductor 





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K7D803671B-HC30 fiche technique
K7D803671B
K7D801871B
256Kx36 & 512Kx18 SRAM
Document Title
8M DDR SYNCHRONOUS SRAM
Revision History
Rev No.
History
Rev. 0.0 -Initial document.
Rev. 0.1 -ZQ tolerance changed from 10% to 15%
Rev. 0.2
-Stop Clock Standby Current condition changed from
VIN=VDD-0.2V or 0.2V fixed to VIN=VIH or VIH
Rev. 0.3
-VDDQ Max. changed to 2.0V
SA0, SA1 defined for Boundary Scan Order
Rev. 0.5 -Deleted -HC16 part(Part Number, Idd, AC Characterisctics)
Rev. 0.6
- Absolute Maximum ratings VDDQ changed from 3.13V to 2.825V
Rev. 0.7
- LBO input level changed from High/Low to VDDQ/VSS
- Stop Clock Standby Current condition changed
from K=Low, K=High to K=Low, K=Low
- tCHQV/tCLQV changed from 0.1ns to 0.2ns for -33 part
from 0.1ns to 0.2ns for -30 part
from 0.1ns to 0.25ns for -25part
- tCHQX/tCLQX changed from -0.3ns to -0.2ns for -33 part
from -0.3ns to -0.2ns for -30 part
from -0.4ns to -0.25ns for -25part
- tCHQZ/tCLQZ changed from 0.1ns to 0.2ns for -33 part
from 0.1ns to 0.2ns for -30 part
from 0.1ns to 0.25ns for -25part
- tKXCH changed from 1.8ns to 1.7ns for -33 part
- tKXCL changed from 1.8ns to 1.7ns for -33 part
Rev. 1.0
- Clarification on the features and the timing waveforms regarding the
burst controllability.
- Recommended DC operating conditions for Clock added.
- AC test conditions for VDDQ=1.8V and Single ended clock added.
(AC Test Conditions 2)
- Package thermal characteristics added.
Rev. 2.0 - Add-HC35 part(Part Number, Idd, AC Characteristics)
Rev. 3.0
- Absolute Maximum Rating VDDQ changed from 2.825V to 2.4V
- VCM-CLK Min changed from 0.6V to 0.68V
Rev. 4.0 - Add-HC37 part(Part Number, Idd, AC Characteristics)
DraftData
July. 2000
Aug. 2000
Oct. 2000
Nov. 2000
Jan. 2001
Feb. 2001
Mar. 2001
Remark
Advance
Advance
Advance
Advance
Prelimary
Prelimary
Prelimary
May. 2001
Final
Sep. 2001
Jan. 2002
Jan. 2002
Final
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters
of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.
-1-
January. 2002
Rev 4.0

PagesPages 16
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