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PDF JANKCA1N4148 Data sheet ( Hoja de datos )
| Número de pieza | JANKCA1N4148 | |
| Descripción | PERFORMANCE SPECIFICATION | |
| Fabricantes | Microsemi Corporation | |
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The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 8 September 2001.
INCH POUND
MIL-PRF-19500/116L
8 June 2001
SUPERSEDING
MIL-PRF-19500/116K
28 February 1997
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING
TYPES 1N914, 1N914UR, 1N4148-1, 1N4148UR-1, 1N4148UB, 1N4148UB2, 1N4148UB2R, 1N4148UBCA,
1N4148UBCC, 1N4148UBCD, 1N4531, AND 1N4531UR, JAN, JANTX, JANTXV, JANHC, AND JANKC
JANS1N4148-1 (see 6.4). Device types 1N914
and 1N4531 are inactive for new design.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon, diffused, switching diodes. Three
levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product
assurance are provided for each unencapsulated device.
1.2 Physical dimensions. See figures 1 (similar to DO-35), 2, 3, 4, and 5.
1.3 Maximum ratings.
Type
V(BR)
V dc
VRWM
V (pk)
Io
TA = 25qC
mA
IFSM
tp =
1/120 s
A (pk)
TSTG
qC
Top
Z6JX
R6JL
R6JC
qC
qC/W
qC/W
qC/W
1N914, UR
1N4531, UR
1N4148-1, UR-1
1N4148UB,
1N4148UB2,
1N4148UB2R,
1N4148UBCA,
1N4148UBCC,
1N4148UBCD,
100 75
100 75
100 75
100 75
75 (1)
125 (2)
200 (3)
200 (3)
1
-65 to +200 -65 to +175
70
N/A
1
-65 to +200 -65 to +175
70
250 N/A
2
-65 to +200 -65 to +200
70
(leaded)
N/A
2 -65 to +200 -65 to +200 70 100(UR) 150
(1) Derate at 0.5 mA/GC above TA = 25GC.
(2) Derate at 0.83 mA/GC above TA = 25GC.
(3) Derate at 1.14 mA/GC above TA = 25GC.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in
improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC-VAC,
P.O. Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal
(DD Form 1426) appearing at the end of this document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
1 page  
MIL-PRF-19500/116L
1
3
1N4148UBCA
2
2
1 1N4148UB
3
1
3 1N4148UBD
2
1
3 1N4148UBCC
2
Symbol
A
A1
B1
B2
B3
D
Inches
Min Max
0.046 0.056
0.017 0.023
0.016 0.024
0.016 0.024
0.016 0.024
0.085 0.105
Millimeters
Min Max
0.97 1.42
0.43 0.58
0.41 0.61
0.41 0.61
0.41 0.61
2.41 2.67
Dimensions
Symbol
Inches
Min Max
D1
0.071
0.078
D2
D3
E
0.115
0.125
E3 - - -
L1
0.022
0.038
L2
0.024
0.036
Millimeters
Min Max
1.81 2.01
2.82
---
0.56
0.61
3.18
0.96
0.81
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Ceramic package only.
FIGURE 3. Physical dimensions, surface mount (UB versions).
5
5 Page 
MIL-PRF-19500/116L
4.5.3 Forward recovery voltage and time. Forward recovery time shall be measured as the time interval between
zero time and the point where the pulse has decreased to 110 percent of the steady-state value of VF when
IF = 50 mA dc. The maximum rise time of the response detector shall be 1 ns.
4.5.4 Decap internal visual scribe and break (not applicable to UB package). Scratch glass at cavity area with
diamond scribe. Carefully snap open. Using 30X magnification examine the area where die was in contact with the
plugs, verify footprint for minimum of 15 percent metallurgical bonding area. In addition, a cross sectional view may
be used to verify consistency of construction. A cross sectional view shall be used exclusively for construction
verification and shall not be used to verify bond integrity. The UB package shall employ the manufacturers’ normal
delidding procedures.
4.5.5 Thermal impedance (Z6JX measurements). Thermal impedance measurements shall be in accordance
method 3101 MIL-STD-750, and as follows.
a. IH = 300 mA to 500 mA.
b. tH = 10 ms.
c. IM = 1 mA to 10 mA.
d. tMD = 70 2s maximum.
The maximum limit for Z6JX under these test conditions is Z6JX = 70GC/W.
4.5.5.1 For initial qualification or requalification. Read and record data (Z6JX) shall be supplied to the qualifying
activity on one lot (random sample of 500 devices minimum) prior to shipment. Twenty two samples shall be
serialized and provided to the qualifying activity for test correlation.
4.5.6 Thermal resistance. Thermal resistance measurement shall be in accordance with method 3101
MIL-STD-750, or method 4081 of MIL-STD-750. Forced moving air or draft shall not be permitted across the device
during test. The maximum limit for R6JL under these test conditions shall be as shown in group B of 4.4.2.1 and
group E of table II. The following conditions shall apply when using method 3101:
a. IH - - - - - - - - - - - - - - - - - - - - - - - - - - - 75 mA to 300 mA.
b. tH - - - - - - - - - - - - - - - - - - - - - - - - - - - 25 seconds minimum.
c. IM - - - - - - - - - - - - - - - - - - - - - - - - - - - 1 mA to 10 mA.
d. tMD - - - - - - - - - - - - - - - - - - - - - - - - - - 70 2s maximum.
11
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