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PDF IDT71V256SB Data sheet ( Hoja de datos )

Número de pieza IDT71V256SB
Descripción 3.3V CMOS FAST SRAM WITH 2.5V COMPATIBLE INPUTS 256K (32K x 8-BIT)
Fabricantes Integrated Device Technology 
Logotipo Integrated Device Technology Logotipo



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Integrated Device Technology, Inc.
3.3V CMOS FAST SRAM
WITH 2.5V COMPATIBLE INPUTS
256K (32K x 8-BIT)
IDT71V256SB
FEATURES
• Ideal for high-performance processor secondary cache
• Fast access times:
— 12/15/20ns
• Inputs are 2.5V and LVTTL compatible: VIH = 1.8V
• Outputs are LVTTL compatible
• Low standby current (maximum):
— 2mA full standby
• Small packages for space-efficient layouts:
— 28-pin 300 mil SOJ
— 28-pin TSOP Type I
• Produced with advanced high-performance CMOS
technology
• Single 3.3V(±0.3V) power supply
DESCRIPTION
The IDT71V256SB is a 262,144-bit high-speed static RAM
organized as 32K x 8. The improved VIH (1.8V) makes the
inputs compatible with 2.5V logic levels. The IDT71V256SB
is otherwise identical to the IDT71V256SA.
The IDT71V256SB has outstanding low power character-
istics while at the same time maintaining very high perfor-
mance. Address access times of as fast as12 ns are ideal for
tag SRAM in secondary cache designs.
When power management logic puts the IDT71V256SB in
standby mode, its very low power characteristics contribute to
extended battery life. By taking CS HIGH, the SRAM will
automatically go to a low power standby mode and will remain
in standby as long as CS remains HIGH. Furthermore, under
full standby mode (CS at CMOS level, f=0), power consump-
tion is guaranteed to always be less than 6.6mW and typically
will be much smaller.
The IDT71V256SB is packaged in 28-pin 300 mil SOJ and
28-pin300 mil TSOP Type I packaging.
FUNCTIONAL BLOCK DIAGRAM
A0
A14
I/O0
I/O7
CS
OE
WE
ADDRESS
DECODER
INPUT
DATA
CIRCUIT
CONTROL
CIRCUIT
262,144 BIT
MEMORY ARRAY
I/O CONTROL
VCC
GND
3770 drw 01
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL TEMPERATURE RANGES
©1997 Integrated Device Technology, Inc.
7.??
JANUARY 1997
3770/1
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IDT71V256SB pdf
IDT71V256SB
3.3V CMOS STATIC RAM WITH 2.5V COMPATIBLE INPUTS 256K (32K x 8-BIT)
TIMING WAVEFORM OF READ CYCLE NO. 2(1, 2, 4)
t RC
ADDRESS
DATAOUT
tAA
t OH
PREVIOUS DATA VALID
TIMING WAVEFORM OF READ CYCLE NO. 3(1, 3, 4)
CS
DATAOUT
t ACS
tCLZ (5)
NOTES:
1. WE is HIGH for Read cycle.
2. Device is continuously selected, CS is LOW.
3. Address valid prior to or coincident with CS transition LOW.
4. OE is LOW.
5. Transition is measured ±200mV from steady state.
COMMERCIAL TEMPERATURE RANGE
tOH
DATA VALID
3770 drw 07
DATA VALID
t CHZ (5)
3770 drw 08
TIMING WAVEFORM OF WRITE CYCLE NO. 1 (WE CONTROLLED TIMING)(1, 2, 3, 5, 7)
t WC
ADDRESS
tOHZ (6)
OE
t AW
CS
t AS
tWP (7)
t WR
WE
DATAOUT
DATAIN
t WHZ (6)
(4)
tOW (6)
t DW
t DH
DATA VALID
(4)
3770 drw 09
NOTES:
1. WE or CS must be HIGH during all address transitions.
2. A write occurs during the overlap of a LOW CS and a LOW WE.
3. tWR is measured from the earlier of CS or WE going HIGH to the end of the write cycle.
4. During this period, I/O pins are in the output state so that the input signals must not be applied.
5. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.
6. Transition is measured ±200mV from steady state.
7. If OE is LOW during a WE controlled write cycle, the write pulse width must be the larger of tWP or (tWHZ + tDW) to allow the I/O drivers to turn off and data
to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the write pulse can
be as short as the spectified tWP.
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