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What is KM416C1004C?

This electronic component, produced by the manufacturer "Samsung semiconductor", performs the same function as "1M x 16Bit CMOS Dynamic RAM with Extended Data Out".


KM416C1004C Datasheet PDF - Samsung semiconductor

Part Number KM416C1004C
Description 1M x 16Bit CMOS Dynamic RAM with Extended Data Out
Manufacturers Samsung semiconductor 
Logo Samsung semiconductor Logo 


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KM416C1004C, KM416C1204C
KM416V1004C, KM416V1204C
CMOS DRAM
1M x 16Bit CMOS Dynamic RAM with Extended Data Out
DESCRIPTION
This is a family of 1,048,576 x 16 bit Extended Data Out CMOS DRAMs. Extended Data Out Mode offers high speed random access of
memory cells within the same row, so called Hyper Page Mode. Power supply voltage (+5.0V or +3.3V), refresh cycle (1K Ref. or 4K
Ref.), access time (-45, -5 or -6), power consumption(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of
this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh
operation is available in L-version. This 1Mx16 EDO Mode DRAM family is fabricated using Samsungs advanced CMOS process to
realize high band-width, low power consumption and high reliability. It may be used as graphic memory unit for microcomputer, personal
computer and portable machines.
FEATURES
Part Identification
- KM416C1004C/C-L (5V, 4K Ref.)
- KM416C1204C/C-L (5V, 1K Ref.)
- KM416V1004C/C-L (3.3V, 4K Ref.)
- KM416V1204C/C-L (3.3V, 1K Ref.)
Active Power Dissipation
Speed
-45
-5
-6
3.3V
4K 1K
--
324 504
288 468
Unit : mW
5V
4K 1K
550 825
495 770
440 715
Refresh Cycles
Part
NO.
C1004C
V1004C
C1204C
V1204C
VCC Refresh
cycle
5V
3.3V
5V
3.3V
4K
1K
Refresh period
Normal L-ver
64ms
16ms
128ms
Performance Range
Speed
-45
-5
-6
tRAC
45ns
50ns
60ns
tCAC
13ns
15ns
17ns
tRC
69ns
84ns
104ns
tHPC
16ns
20ns
25ns
Remark
5V/3.3V
5V/3.3V
5V/3.3V
• Extended Data Out Mode operation
(Fast Page Mode with Extended Data Out)
• 2 CAS Byte/Word Read/Write operation
• CAS-before-RAS refresh capability
• RAS-only and Hidden refresh capability
• Self-refresh capability (L-ver only)
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs
• Early Write or output enable controlled write
• JEDEC Standard pinout
• Available in plastic SOJ 400mil and TSOP(II) packages
• Single +5V±10% power supply (5V product)
• Single +3.3V±0.3V power supply (3.3V product)
FUNCTIONAL BLOCK DIAGRAM
RAS
UCAS
LCAS
W
Control
Clocks
VBB Generator
A0-A11
(A0 - A9) *1
A0 - A7
(A0 - A9) *1
Refresh Timer
Refresh Control
Refresh Counter
Row Address Buffer
Col. Address Buffer
Row Decoder
Memory Array
1,048,576 x16
Cells
Column Decoder
Note) *1 : 1K Refresh
Vcc
Vss
Lower
Data in
Buffer
Lower
Data out
Buffer
Upper
Data in
Buffer
Upper
Data out
Buffer
DQ0
to
DQ7
OE
DQ8
to
DQ15
SAMSUNG ELECTRONICS CO., LTD. reserves the right to
change products and specifications without notice.

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KM416C1004C equivalent
KM416C1004C, KM416C1204C
KM416V1004C, KM416V1204C
CAPACITANCE (TA=25°C, VCC=5V or 3.3V, f=1MHz)
Parameter
Symbol
Input capacitance [A0 ~ A11]
CIN1
Input capacitance [RAS, UCAS, LCAS, W, OE]
CIN2
Output capacitance [DQ0 - DQ15]
CDQ
Min
-
-
-
CMOS DRAM
Max
5
7
7
Units
pF
pF
pF
AC CHARACTERISTICS (0°CTA70°C, See note 1,2)
Test condition (5V device) : VCC=5.0V±10%, Vih/Vil=2.4/0.8V, Voh/Vol=2.0/0.8V
Test condition (3.3V device) : VCC=3.3V±0.3V, Vih/Vil=2.2/0.7V, Voh/Vol=2.0/0.8V
Parameter
Symbol
-45
Min Max
-5
Min Max
Random read or write cycle time
Read-modify-write cycle time
Access time from RAS
Access time from CAS
Access time from column address
CAS to output in Low-Z
Output buffer turn-off delay from CAS
OE to output in Low-Z
Transition time (rise and fall)
RAS precharge time
RAS pulse width
RAS hold time
CAS hold time
tRC
tRWC
tRAC
tCAC
tAA
tCLZ
tCEZ
tOLZ
tT
tRP
tRAS
tRSH
tCSH
79 84
105 115
45 50
14 15
23 25
33
3 13 3 13
33
2 50 2 50
30 30
45 10K 50 10K
13 13
36 40
CAS pulse width
RAS to CAS delay time
RAS to column address delay time
CAS to RAS precharge time
Row address set-up time
Row address hold time
Column address set-up time
Column address hold time
Column address to RAS lead time
Read command set-up time
Read command hold time referenced to CAS
Read command hold time referenced to RAS
Write command hold time
Write command pulse width
Write command to RAS lead time
Write command to CAS lead time
tCAS
tRCD
tRAD
tCRP
tASR
tRAH
tASC
tCAH
tRAL
tRCS
tRCH
tRRH
tWCH
tWP
tRWL
tCWL
7 10K 8 10K
19 31 20 35
14 22 15 25
55
00
9 10
00
78
23 25
00
00
00
8 10
8 10
10 13
78
-6
Min Max
104
140
60
17
30
3
3 15
3
2 50
40
60 10K
17
50
10 10K
20 43
15 30
5
0
10
0
10
30
0
0
0
10
10
15
10
Units Notes
ns
ns
ns 3,4,10
ns 3,4,5
ns 3,10
ns 3
ns 6,19
ns 3
ns 2
ns
ns
ns
ns
ns 18
ns 4
ns 10
ns
ns
ns
ns 11
ns 11
ns
ns
ns 8
ns 8
ns
ns
ns
ns 14


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Featured Datasheets

Part NumberDescriptionMFRS
KM416C1004CThe function is 1M x 16Bit CMOS Dynamic RAM with Extended Data Out. Samsung semiconductorSamsung semiconductor

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