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PDF IDT70V659S Data sheet ( Hoja de datos )

Número de pieza IDT70V659S
Descripción HIGH-SPEED 3.3V 128K x 36 ASYNCHRONOUS DUAL-PORT STATIC RAM
Fabricantes Integrated Device Technology 
Logotipo Integrated Device Technology Logotipo



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No Preview Available ! IDT70V659S Hoja de datos, Descripción, Manual

HIGH-SPEED 3.3V 128K x 36
ASYNCHRONOUS DUAL-PORT
STATIC RAM
PRELIMINARY
IDT70V659S
Features
x True Dual-Port memory cells which allow simultaneous
access of the same memory location
x High-speed access
– Commercial: 10/12/15ns (max.)
– Industrial: 12/15ns (max.)
x Dual chip enables allow for depth expansion without
external logic
x IDT70V659 easily expands data bus width to 72 bits or
more using the Master/Slave select when cascading more
than one device
x M/S = VIH for BUSY output flag on Master,
M/S = VIL for BUSY input on Slave
x Busy and Interrupt Flags
x On-chip port arbitration logic
x Full on-chip hardware support of semaphore signaling
between ports
x Fully asynchronous operation from either port
x Separate byte controls for multiplexed bus and bus
matching compatibility
x Supports JTAG features compliant to IEEE 1149.1
x LVTTL-compatible, single 3.3V (±150mV) power supply for
core
x LVTTL-compatible, selectable 3.3V (±150mV)/2.5V (±100mV)
power supply for I/Os and control signals on each port
x Available in a 208-pin Plastic Quad Flatpack, 208-ball fine
pitch Ball Grid Array, and 256-ball Ball Grid Array
x Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Functional Block Diagram
BE3L
BE2L
BE1L
BE0L
R/W L
CE0 L
CE1L
B BB
E EE
0 12
L LL
BB BB B
EE EE E
33 21 0
LR RR R
BE3R
BE2R
BE1R
BE0R
R/WR
CE0 R
CE1R
OE
L
I/O0L- I/O35L
Dout0-8_L
Dout9-17_L
Dout18-26_L
Dout27-35_L
Dout0-8_R
Dout9-17_R
Dout18-26_R
Dout27-35_R
128K x 36
MEMORY
ARRAY
Di n_L
Di n_R
OE
R
I/O0R - I/O35R
A16 L
A0 L
Address
Decoder
ADDR_L
ADDR_R
Address
Decoder
A16R
A0R
BUSYL
SEML
INTL
CE 0 L
CE1L
OEL
R/WL
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
M/S
TDI
TDO
JTAG
NOTES:
1. BUSY is an input as a Slave (M/S=VIL) and an output when it is a Master (M/S=VIH).
2. BUSY and INT are non-tri-state totem-pole outputs (push-pull).
©2001 Integrated Device Technology, Inc.
1
OER
R/WR
CE0 R
CE1R
TMS
TCK
TRST
BUSYR
SEMR
INTR
4869 drw 01
JUNE 2001
DSC-4869/3

1 page




IDT70V659S pdf
IDT70V659S
High-Speed 3.3V 128K x 36 Asynchronous Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Pin Names
Left Port
Right Port
Names
CE0L, CE1L
R/WL
CE0R, CE1R
R/WR
Chip Enables
Read/Write Enable
OEL OER Output Enable
A0L - A16L
A0R - A16R
Address
I/O0L - I/O35L
I/O0R - I/O35R
Data Input/Output
SEML
SEMR
Semaphore Enable
INTL INTR Interrupt Flag
BUSYL
BUSYR
Busy Flag
BE0L - BE3L
VDDQL
BE0R - BE3R
VDDQR
Byte Enables (9-bit bytes)
Power (I/O Bus) (3.3V or 2.5V)(1)
OPTL
OPTR
M/S
Option for selecting VDDQX(1,2)
Master or Slave Select
VDD Power (3.3V)(1)
VSS
TDI
TDO
TCK
TMS
TRST
Ground (0V)
Test Data Input
Test Data Output
Test Logic Clock (10MHz)
Test Mode Select
Reset (Initialize TAP Controller)
4869 tbl 01
NOTES:
1. VDD, OPTX, and VDDQX must be set to appropriate operating levels prior to
applying inputs on I/OX.
2. OPTX selects the operating voltage levels for the I/Os and controls on that port.
If OPTX is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V
levels and VDDQX must be supplied at 3.3V. If OPTX is set to VIL (0V), then that
port's I/Os and controls will operate at 2.5V levels and VDDQX must be supplied
at 2.5V. The OPT pins are independent of one another—both ports can operate
at 3.3V levels, both can operate at 2.5V levels, or either can operate at 3.3V
with the other at 2.5V.
5

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IDT70V659S arduino
IDT70V659S
High-Speed 3.3V 128K x 36 Asynchronous Dual-Port Static RAM
Waveform of Read Cycles(5)
tRC
ADDR
CE(6)
tAA (4)
tACE (4)
tAOE (4)
OE
BEn
tABE (4)
Preliminary
Industrial and Commercial Temperature Ranges
R/W
DATAOUT
BUSYOUT
tLZ (1)
(4)
VALID DATA
tBDD (3,4)
tOH
tHZ (2)
4869 drw 06
NOTES:
1. Timing depends on which signal is asserted last, OE, CE or BEn.
2. Timing depends on which signal is de-asserted first CE, OE or BEn.
3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY
has no relation to valid output data.
4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD.
5. SEM = VIH.
Timing of Power-Up Power-Down
CE
tPU
ICC
50%
ISB
tPD
50%
.
4869 drw 07
11

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