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PDF 74F173 Data sheet ( Hoja de datos )
| Número de pieza | 74F173 | |
| Descripción | Quad D-type flip-flop 3-State | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
74F173
Quad D-type flip-flop (3-State)
Product specification
IC15 Data Handbook
1990 Aug 31
Philips
Semiconductors
1 page  
Philips Semiconductors
Quad D-type flip–flop (3-State)
Product specification
74F173
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC
VIH
VIL
IIk
IOH
IOL
Tamb
Supply voltage
High–level input voltage
Low–level input voltage
Input clamp current
High–level output current
Low–level output current
Operating free air temperature range
LIMITS
UNIT
MIN
NOM
MAX
4.5 5.0 5.5 V
2.0 V
0.8 V
–18 mA
–15 mA
48 mA
0 +70 °C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
CONDITIONS1
LIMITS
UNIT
MIN TYP2 MAX
VCC = MIN, VIL = MAX,
±10%VCC 2.4
V
VOH High-level output voltage
VIH = MIN, IOH = MAX
±5%VCC 2.7 3.4
V
VCC = MIN, VIL = MAX,
±10%VCC 2.0
V
VIH = MIN, IOH = –15mA
±5%VCC 2.0 3.1
V
VOL Low-level output voltage
VIK Input clamp voltage
II Input current at maximum input voltage
IIH High–level input current
IIL Low–level input current
VCC = MIN, VIL = MAX,
VIH = MIN, IOL = MAX
VCC = MIN, II = IIK
VCC = MAX, VI = 7.0V
VCC = MAX, VI = 2.7V
VCC = MAX, VI = 0.5V
±10%VCC
±5%VCC
0.35
0.35
–0.73
0.50
0.50
-1.2
100
20
–0.6
V
V
V
µA
µA
mA
IOZH
Off–state output current, high–level voltage applied VCC = MAX, VO = 2.7V
50 µA
IOZL
Off–state output current, low–level voltage applied
VCC = MAX, VO = 0.5V
–50 µA
IOS Short–circuit output current3
VCC = MAX
-60 -150 mA
ICCH
19 26 mA
ICC Supply current (total)
ICCL VCC = MAX
27 37 mA
ICCZ
23 32 mA
Notes to DC electrical characteristics
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
August 31, 1990
5
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet 74F173.PDF ] | |
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