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PDF ECP052G Data sheet ( Hoja de datos )
| Número de pieza | ECP052G | |
| Descripción | Watt/ High Linearity InGaP HBT Amplifier | |
| Fabricantes | ETC | |
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ECP052
½ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
Product Features
• 800 – 1000 MHz
• +28.5 dBm P1dB
• +44 dBm Output IP3
• 18 dB Gain @ 900 MHz
• Single Positive Supply (+5V)
• Available in SOIC-8 or 16pin
4mm QFN package
Applications
• Final stage amplifiers for
Repeaters
• Mobile Infrastructure
Product Description
The ECP052 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance for various
narrowband-tuned application circuits with up to +44
dBm OIP3 and +28.5 dBm of compressed 1dB power. It
is housed in an industry standard SOIC-8 or 16-pin
4x4mm QFN SMT package. All devices are 100% RF
and DC tested.
The ECP052 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECP052 to maintain high linearity over temperature and
operate directly off a single +5V supply. This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
Functional Diagram
Vref 1
N/C 2
RF IN 3
N/C 4
16 15 14 13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
5678
ECP052D
Vref 1
N/C 2
RF IN 3
N/C 4
8 Vbias
7 RF OUT
6 RF OUT
5 N/C
ECP052G
Specifications (1)
Parameter
Units
Operational Bandwidth
MHz
Test Frequency
MHz
Gain dB
Output P1dB
Output IP3 (2)
dBm
dBm
Test Frequency
MHz
Gain dB
Input Return Loss
dB
Output Return Loss
dB
Output P1dB
Output IP3 (2)
dBm
dBm
IS-95A Channel Power
@ -45 dBc ACPR, 1960 MHz
Noise Figure
Operating Current Range, Icc (3)
dBm
dB
mA
Device Voltage, Vcc
V
Min
800
15.5
+27
+42.5
15.5
+27
+42.5
200
Typ
850
17
+28
+44
900
17.8
18
7
+28.7
+43
+23
7
250
+5
Max
1000
300
1. Test conditions unless otherwise noted: 25ºC, Vsupply = +5 V, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a
reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.)
Absolute Maximum Rating
Ordering Information
Parameters
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Rating
-40 to +85 °C
-65 to +150 °C
+28 dBm
+8 V
400 mA
2W
Part No.
ECP052D
ECP052G
ECP052D-PCB900
ECP052G-PCB900
Description
½ Watt InGaP HBT Amplifier (16p 4mm Pkg)
½ Watt InGaP HBT Amplifier (SOIC-8 Pkg)
900 MHz Evaluation Board
900 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
1 page  
ECP052
½ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
ECP052D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“ECP052D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
0.65mm
TYP.
Land Pattern
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,
BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL,
VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE
PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN
REFLOW PROCESS
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
DEVICE GROUND PAD
2.0mm X 2.0mm
RECOMMENDED PAD
0.76mm X 0.34mm
4.00mmTYP.
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
16L 4.0mm X 4.0mm PACKAGE
Thermal Specifications
Parameter
Rating
MTTF vs. GND Tab Temperature
100000
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85° C
62° C / W
162° C
10000
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85° C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
250 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247° C.
1000
100
60
70 80 90 100 110
Tab Temperature (°C)
120
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard: JEDEC Standard J-STD-020
Functional Diagram
Vref 1
N/C 2
RF IN 3
N/C 4
16 15 14
567
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
8
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8 All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
5 Page | ||
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