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PDF ECG008 Data sheet ( Hoja de datos )
| Número de pieza | ECG008 | |
| Descripción | InGaP HBT Gain Block | |
| Fabricantes | ETC | |
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ECG008
InGaP HBT Gain Block
The Communications Edge TM
Product Information
Product Features
x DC – 4 GHz
x +24 dBm P1dB at 1 GHz
x +40 dBm OIP3 at 1 GHz
x 15 dB Gain at 1 GHz
x 4.6 dB Noise Figure at 2 GHz
x SOT-89 and lead-free / green
SOT-89 Package Styles
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
The ECG008 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG008 typically provides 15
dB of gain, +40 dBm Output IP3, and +24 dBm P1dB.
The ECG008 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in a low
cost, surface-mountable SOT-89 package. The ECG008 is
also available in a lead-free/green/RoHS-compliant SOT-
89 package. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG008 will work for other various applications within
the DC to 4 GHz frequency range such as CATV and fixed
wireless.
Functional Diagram
GND
4
123
RF IN GND RF OUT
ECG008B / ECG008B-G
Specifications (1)
Typical Performance (3)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3 (3)
Noise Figure
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
Output mismatch w/o spurs
Units
MHz
MHz
dB
dBm
dBm
dB
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
VSWR
Min
DC
13
+34
6.8
Typ
1000
15
+24
+40
4.6
2000
14.3
25
14
+23
+37
4.8
7.3
120
10:1
Max
4000
7.8
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +9 V, Rbias = 14 ¡ , 50 ¡ System.
2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
14.7
-26
-19.4
+24.3
+41
4.7
Typical
900 1900
14.6 14.3
-28.5 -28
-17.4 -13.4
+24 +23.3
+40 +37
4.6 4.7
2140
14.3
-19.5
-15
+19.0
+30.5
4.8
3. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = +7.3V, Rbias = 14 ¡ , 50 ¡ System.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Current
Junction Temperature
Rating
-40 to +85 qC
-65 to +150 qC
+15 dBm
160 mA
+250 qC
Ordering Information
Part No.
ECG008B
ECG008B-G
ECG008B-PCB
Description
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
700 –2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
December 2004
1 page  
ECG008
InGaP HBT Gain Block
The Communications Edge TM
Product Information
ECG008B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“ E008G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260¥ C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
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December 2004
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet ECG008.PDF ] | |
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