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PDF FDC697P Data sheet ( Hoja de datos )

Número de pieza FDC697P
Descripción P-Channel 1.8V PowerTrench MOSFET
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! FDC697P Hoja de datos, Descripción, Manual

January 2004
FDC697P
P-Channel 1.8V PowerTrenchMOSFET
General Description
This P-Channel 1.8V specified MOSFET uses
Fairchild’s advanced low voltage Power Trench
process. It has been optimized for battery power
management applications.
Applications
Battery management
Load Switch
Battery protection
Features
–8 A, –20 V
RDS(ON)
RDS(ON)
RDS(ON)
= 20 m@ VGS = –4.5 V
= 25 m@ VGS = –2.5 V
= 35 m@ VGS = –1.8 V
High performance trench technology for extremely
low RDS(ON)
Fast switching speed
FLMP SuperSOT-6 package: Enhanced thermal
performance in industry-standard package size
G
S
S
SuperSOT-6TM FLMP
S
S
S
1
2
3
Bottom
Drain
6
5
4
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
Parameter
VDSS
VGSS
ID
Drain-Source Voltage
Gate-Source Voltage
Drain Current – Continuous
– Pulsed
(Note 1a)
PD Power Dissipation
(Note 1a)
(Note 1b)
TJ, TSTG
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJA Thermal Resistance, Junction-to-Ambient
RθJC Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1b)
Package Marking and Ordering Information
Device Marking
Device
Reel Size
.697
FDC697P
7’’
Ratings
–20
±8
–8
–40
2
1.5
–55 to +150
60
111
0.5
Tape width
8mm
Units
V
V
A
W
°C
°C/W
Quantity
3000 units
2004 Fairchild Semiconductor Corporation
FDC697P Rev C2 (W)

1 page




FDC697P pdf
Typical Characteristics
5
ID = -8A
4
3
VDS = -5V
-15V
-10V
2
1
0
0 10 20 30 40 50
Qg, GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
100
RDS(ON) LIMIT
10
1
1ms
10ms
100ms
1s
10s
DC
VGS = -4.5V
0.1 SINGLE PULSE
RθJA = 100oC/W
TA = 25oC
0.01
0.1
1 10
-VDS, DRAIN-SOURCE VOLTAGE (V)
100
Figure 9. Maximum Safe Operating Area.
5000
4500
4000
3500
3000
2500
2000
1500
1000
500 CRSS
0
0.0
CISS
f = 1MHz
VGS = 0 V
COSS
5.0
10.0
15.0
-VDS, DRAIN TO SOURCE VOLTAGE (V)
20.0
Figure 8. Capacitance Characteristics.
50
SINGLE PULSE
40
RθJA = 100°C/W
TA = 25°C
30
20
10
0
0.01
0.1
1 10
t1, TIME (sec)
100 1000
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
0.1
0.01
0.2
0.1
0.05
0.02
0.01
0.001
0.001
SINGLE PULSE
0.01
0.1 1
10
t1, TIME (sec)
RθJA(t) = r(t) * RθJA
RθJA = 100 °C/W
P(pk)
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
100 1000
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDC697P Rev C2 (W)

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