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PDF M14C32 Data sheet ( Hoja de datos )
| Número de pieza | M14C32 | |
| Descripción | Memory Card IC 64/32 Kbit Serial IC Bus EEPROM | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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D10, D15, D20, D22, C20, C30
MICROMODULES
Memory Micromodules
General Information for D1, D2 and C Packaging
s Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
s The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the
module to the plastic package
s Physical dimensions and contact positions
compliant to the ISO 7816 standard
s Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
DESCRIPTION
Memory Cards consist of two main parts: the
plastic card, and the embedded Micromodule
(which, in turn, carries the silicon chip).
The plastic card is made of PVC, ABS or similar
material, and can be over-printed with graphics,
text, and magnetic strips. The Micromodule is
embedded in a cavity in the plastic card.
The Micromodules are mounted on Super 35 mm
metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of
wafers, including those chips that were found to be
non-functioning during testing. Traceability is
ensured by a label fixed on the reel.
potting side
contact side
D15
D10
D20
D22
C30 C20
Table 1. Memory Card and Memory Tag Integrated Circuits
Modul e
Please see the data briefing sheets of these products for example illustrations of these
micromodule s
D10 ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355
D15 ST14C02, ST1305B, ST1335, ST1336, ST1355
D20 ST14C02, M14C04, M14C16, M14C32
D22 M14C64, M14128, M14256
C30 M35101, M35102
C20 M35101, M35102
December 1999
1/13
1 page  
MICROMODULES
RELIABILITY
Product qualification and on-going reliability
monitoring is performed by ST. The principal steps
are listed in Table 8 and Table 9.
Table 8. Package Related Tests
Test
Description
Method
Condit ion
LPTD
Criteria
(note 1)
1 Geometry
ST Specification Monitoring/Lot
5 0/45
2 Visual inspection
ST Specification Outgoing/Lot
AQL= 0.040 0/315
3
Temperature cycling
MIL-STD-883
Method 1010
-40 °C to 150 °C, 100 cycles
5
0/45
4
Salt atmosphere
corrosion of contacts
MIL-STD-883
Method 1009
35 °C, 5% NaCl, 24 hour
15 0/15
5
Moisture resistance
MIL-STD-883
Method 1004
85 °C, 85% HR Biased 5.5 V,
168 hour
7
0/32
6
Vibration with electrical
measurement
ISO/IEC 10373
1 octave/minute, acceleration up to
10 G (repeated 20 times)
20
measurement memory check at 25 °C
0/11
7 Bending properties
Long side: deflection 2 cm
ISO/IEC 7816-1 Short side: deflection 1 cm
30 bendings per minute
20
0/11
8 Torsion properties
Maximum displacement 15° ±1°
ISO/IEC 7816-1 1000 torsions, 30 torsions per minute
applied on long side only
20
0/11
Note: 1. The notation m/n means: reject the whole lot if more than m devices fail from a sample of n devices. For instance, 0/45 means a
sample of 45 devices taken from a lot, with the whole lot only accepted if every one of the 45 sample devices passed the test.
Table 9. Product Related Tests
Test
Description
Method
Condit ion
LPTD
1 Life test
MIL-STD-883
Method 1005
140 °C, 6 V, 504 hours measurement 3
memory check at 25 °C
2 Electrostatic discharge MIL-STD-883
Method 3015
Human body model:
1.5 kΩ, 100 pF, ± 5000 V
n/a
Electrostatic discharge MIL-STD-883
Method 3015
Machine model: 0 Ω, 200 pF, ± 200 V n/a
measurement memory check at 25 °C
3 Data retention,
Temperature storage
MIL-STD-883
Method 1005
150 °C, 1000 hours, no bias
5
measurement memory check at 25 °C
4 Write/Erase cycles
ST Specification 100,000 Cycles
200 ppm/
1024 byte/
1000 cycle
5 Magnetic field, memory ISO IEC 10373 79,500 A/m
check
15
6 X-rays, memory check ISO IEC 10373 70 kV, 0.1 Grey
15
7 UV light, memory check ISO IEC 10373 15 W.s/cm2, 30 minutes maximum
15
Criteria
0/76
0/9
0/9
0/45
0/32
1/25
1/25
1/25
5/13
5 Page 
MICROMODULES
Figure 6. D20 Micromodule Outline
11
11
11
11
11/13
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet M14C32.PDF ] | |
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| Número de pieza | Descripción | Fabricantes |
| M14C32 | Memory Micromodules General Information for D1/ D2 and C Packaging | STMicroelectronics |
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| M14C32DD | M14C32 Die Description | STMicroelectronics |
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