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Número de pieza | BAS86 | |
Descripción | Schottky barrier single diode | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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No Preview Available ! BAS86
Schottky barrier single diode
25 July 2012
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device
(SMD) package with tin-plated metal discs at each end. It is suitable for “automatic
placement” and as such it can withstand immersion soldering.
1.2 Features and benefits
• Low forward voltage
• High breakdown voltage
• Guard ring protected
• Hermetically sealed glass SMD package.
1.3 Applications
• Ultra high-speed switching
• Voltage clamping
• Protection circuits
• Blocking diodes
1.4 Quick reference data
Table 1.
Symbol
IF(AV)
VR
VF
Quick reference data
Parameter
average forward
current
reverse voltage
forward voltage
Conditions
IF = 100 mA; Tamb = 25 °C
Min Typ Max Unit
[1] - - 200 mA
- - 50 V
- - 900 mV
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
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1 page NXP Semiconductors
tr tp
RS = 50 Ω
V = VR + IF × RS
D.U.T.
IF
10 %
SAMPLING
OSCILLOSCOPE
Ri = 50 Ω
VR 90 %
mga881
input signal
(1) IR = 1 mA
Fig. 5. Reverse recovery time test circuit and waveforms
9. Package outline
BAS86
Schottky barrier single diode
t
+ IF
trr
t
(1)
output signal
0.3
3.7
3.3
Dimensions in mm
Fig. 6. LLDS; MiniMelf (SOD80C)
0.3
1.60
1.45
06-03-16
10. Soldering
4.55
4.30
2.30
2.25 1.70 1.60
0.90
(2x)
sod080c
Fig. 7. Reflow soldering footprint for SOD80C (LLDS; MiniMelf)
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
BAS86
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 July 2012
© NXP B.V. 2012. All rights reserved
5/9
5 Page |
Páginas | Total 9 Páginas | |
PDF Descargar | [ Datasheet BAS86.PDF ] |
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