BAS16VV Datasheet PDF - NXP Semiconductors
| Part Number | BAS16VV | |
| Description | High-speed switching diodes | |
| Manufacturers | NXP Semiconductors | |
| Logo |  |
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BAS16 series
High-speed switching diodes
Rev. 6 — 24 September 2014
Product data sheet
1. Product profile
1.1 General description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1. Product overview
Type number Package
NXP
JEITA
BAS16
SOT23
-
BAS16H
SOD123F -
BAS16J
SOD323F SC-90
BAS16L
SOD882 -
BAS16T
BAS16VV
SOT416
SOT666
SC-75
-
BAS16VY
BAS16W
BAS316
BAS516
SOT363
SOT323
SOD323
SOD523
SC-88
SC-70
SC-76
SC-79
JEDEC
TO-236AB
-
-
Configuration
single
single
single
- single
- single
- triple isolated
- triple isolated
- single
- single
- single
Package
configuration
small
small and flat lead
very small and flat
lead
leadless ultra
small
ultra small
ultra small and flat
lead
very small
very small
very small
ultra small and flat
lead
1.2 Features and benefits
High switching speed: trr 4 ns
Low leakage current
Repetitive peak reverse voltage:
VRRM 100 V
AEC-Q101 qualified
Low capacitance
Reverse voltage: VR 100 V
Small SMD plastic packages
1.3 Applications
High-speed switching
General-purpose switching
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NXP Semiconductors
BAS16 series
High-speed switching diodes
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BAS16
BAS16H
BAS16J
BAS16L
BAS16VV
Rth(j-sp)
BAS16W
thermal resistance from
junction to solder point
BAS16
BAS16H
BAS16J
BAS16T
BAS16VY
BAS16W
BAS316
BAS516
Conditions
in free air
Min Typ Max Unit
[1] - - 500 K/W
[2] - - 330 K/W
[3] - - 150 K/W
[3] - - 230 K/W
[2] - - 500 K/W
[2][4] - - 700 K/W
[3][4] - - 410 K/W
[1] - - 625 K/W
- - 330 K/W
[5] - - 70 K/W
[5] - - 55 K/W
- - 350 K/W
[4][6] - - 260 K/W
- - 300 K/W
[5] - - 150 K/W
[5] - - 120 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB with 60 m copper strip line.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Single diode loaded.
[5] Soldering point of cathode tab.
[6] Soldering points at pins 4, 5 and 6.
BAS16_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 24 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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| Information | Total 21 Pages | |
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| Download | [ BAS16VV.PDF Datasheet ] | |
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