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PDF HMC362S8G Data sheet ( Hoja de datos )
| Número de pieza | HMC362S8G | |
| Descripción | SMT GaAs HBT MMIC | |
| Fabricantes | Hittite Microwave Corporation | |
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HMC362S8G / 362S8GE
v03.0505
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 12 GHz
6
Typical Applications
Prescaler for DC to X Band PLL Applications:
• Satellite Communication Systems
• Fiber Optic
• Point-to-Point and Point-to-Multi-Point Radios
• VSAT
Features
Ultra Low SSB Phase Noise: -149 dBc/Hz
Wide Bandwidth
Output Power: -6 dBm
Single DC Supply: +5V
S8G SMT Package
Functional Diagram
General Description
The HMC362S8G & HMC362S8GE are low noise
Divide-by-4 Static Dividers with InGaP GaAs HBT
technology in 8 lead surface mount plastic packages.
This device operates from DC (with a square wave
input) to 12 GHz input frequency with a single +5V
DC supply. The low additive SSB phase noise of -149
dBc/Hz at 100 kHz offset helps the user maintain good
system noise performance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc = 5V
Parameter
Maximum Input Frequency
Minimum Input Frequency
Input Power Range
Ouput Power
Reverse Leakage
SSB Phase Noise (100 kHz offset)
Output Transition Time
Conditions
Sine Wave Input. [1]
Fin = 1 to 8 GHz
Fin = 8 to 10 GHz
Fin = 10 to 12 GHz
Fin = 11 GHz
Both RF Outputs Terminated
Pin = 0dBm, Fin = 6 GHz
Pin = 0 dBm, Fout = 882 MHz
Min.
12
-15
-10
-5
-9
Typ.
13
0.2
>-20
>-15
>-8
-6
60
-149
100
Supply Current (Icc)
68
1. Divider will operate down to DC for square-wave input signal.
Max.
0.5
+10
+3
0
Units
GHz
GHz
dBm
dBm
dBm
dBm
dB
dBc/Hz
ps
mA
6-8
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1 page  
6
Evaluation PCB
v03.0505
HMC362S8G / 362S8GE
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 12 GHz
List of Materials for Evaluation PCB 104631 [1]
Item
Description
J1 - J3
PCB Mount SMA RF Connector
C1 - C4
100 pF Capacitor, 0402 Pkg.
C5 1000 pF Capacitor, 0603 Pkg.
C6 10 μF Tantalum Capacitor
U1
PCB [2]
HMC362S8G / HMC362S8GE Divide-by-4
104627 Eval Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
The circuit board used in the final application should
use RF circuit design techniques. Signal lines
should have 50 ohm impedance while the package
ground leads and backside ground slug should be
connected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation circuit board shown is available
from Hittite upon request. This evaluation board is
designed for single ended input testing. J2 and J3
provide differential output signals.
6 - 12
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5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC362S8G.PDF ] | |
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