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PDF HMC344 Data sheet ( Hoja de datos )
| Número de pieza | HMC344 | |
| Descripción | GaAs MMIC SP4T NON-REFLECTIVE SWITCH/ DC - 8.0 GHz | |
| Fabricantes | Hittite Microwave Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC344 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MICROWAVE CORPORATION
v01.0404
HMC344
GaAs MMIC SP4T NON-REFLECTIVE
SWITCH, DC - 8.0 GHz
Typical Applications
The HMC344 is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
Functional Diagram
7
Features
Broadband Performance: DC - 8.0 GHz
Low Insertion Loss: 1.8 dB @ 6.0 GHz
Integrated 2:4 TTL Decoder
Small Size: 1.08 mm x 1.05 mm x 0.10 mm
General Description
The HMC344 is a broadband non-reflective GaAs
MESFET SP4T switch chip. Covering DC to 8.0
GHz, this switch offers high isolation and low
insertion loss and extends the frequency cover-
age of Hittite’s SP4T switch product line. This
switch also includes an on board binary decoder
circuit which reduces the required logic control
lines to two. The switch operates using a nega-
tive control voltage of 0/-5V, and requires a fixed
bias of -5V. All data is tested with the chip in a 50
Ohm test fixture connected via 0.025 mm (1 mil)
diameter wire bonds of minimal length 0.31 mm
(12 mils).
Electrical Specifications, TA = +25° C, With 0/-5V Control, Vee= -5V, 50 Ohm System
Parameter
Frequency
Min.
Typ.
Max.
Units
Insertion Loss
DC - 6.0 GHz
DC - 8.0 GHz
1.8 2.1 dB
1.9 2.2 dB
Isolation
DC - 2.0 GHz 44 49
DC - 4.0 GHz 37 42
DC - 6.0 GHz 34 39
DC - 8.0 GHz 30 35
dB
dB
dB
dB
Return Loss
“On State”
DC - 2.0 GHz 10 14
DC - 8.0 GHz 7 10
dB
dB
Return Loss
“Off State”
DC - 8.0 GHz
7 10
dB
Input Power for 1 dB Compression
0.5 - 8.0 GHz 17 21
dBm
Input Third Order Intercept
(Two-Tone Input Power= +7 dBm Each Tone)
0.5 - 8.0 GHz 37 40
dBm
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
DC - 8.0 GHz
35 ns
150 ns
7 - 20
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
1 page  
MICROWAVE CORPORATION
v01.0404
HMC344
GaAs MMIC SP4T NON-REFLECTIVE
SWITCH, DC - 8.0 GHz
Assembly Diagram
7
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting
surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a tool temperature
of 265 deg. C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 deg. C. DO NOT expose the chip
to a temperature greater than 320 deg. C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for
attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
7 - 24
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC344.PDF ] | |
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