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PDF HMC205 Data sheet ( Hoja de datos )
| Número de pieza | HMC205 | |
| Descripción | GaAs MMIC PASSIVE FREQUENCY DOUBLER/ 6 - 12 GHz INPUT | |
| Fabricantes | Hittite Microwave Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC205 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MICROWAVE CORPORATION
v02.1201
HMC205
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Typical Applications
The HMC205 is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Pt to Pt Radios
• Test Equipment
4 Functional Diagram
Features
Conversion Loss: 12 to 17 dB
Fo, 3Fo, 4Fo Isolation: 32 dB
Passive: No Bias Required
General Description
The HMC205 is a passive miniature frequency dou-
bler in a MMIC die. Suppression of undesired funda-
mental and higher order harmonics is 32 dB typical
with respect to input signal level. The doubler uti-
lizes the same GaAs Schottky diode/balun technol-
ogy found in Hittite MMIC mixers. It features small
size, no DC bias, and no measurable additive phase
noise onto the multiplied signal.
Electrical Specifications, TA = +25° C, As a Function of Drive Level
Input = +10 dBm
Input = +12 dBm
Input = +15 dBm
Parameter
Min.
Typ. Max. Min.
Typ.
Max.
Min.
Typ. Max.
Frequency Range, Input
7.0 - 12.0
6.0 - 12.0
6.0 - 12.0
Frequency Range, Output
14.0 - 24.0
12.0 - 24.0
12.0 - 24.0
Conversion Loss
18 21
17 20
15 18
FO Isolation
(with respect to input level)
28 32
3FO Isolation
(with respect to input level)
36 40
4FO Isolation
(with respect to input level)
26 32
Units
GHz
GHz
dB
dB
dB
dB
4 - 16
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
1 page  
v02.1201
MICROWAVE CORPORATION
HMC205
GaAs MMIC FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid clean-
ing systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
4 bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent
tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet,
tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically con-
ductive epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage tem-
perature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Use the minimum level of ultrasonic energry to achieve reliable wirebonds. Wirebonds
should be started on the chip and terminated on the package. RF bonds should be as short as possible.
4 - 20
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMC205.PDF ] | |
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