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PDF HPMX-3003-TR1 Data sheet ( Hoja de datos )
| Número de pieza | HPMX-3003-TR1 | |
| Descripción | 1.5 - 2.5 GHz LNA Switch PA | |
| Fabricantes | Agilent(Hewlett-Packard) | |
| Logotipo | .gif "Agilent(Hewlett-Packard)"){kind=logo} |
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1.5 – 2.5 GHz LNA Switch PA
Technical Data
HPMX-3003
Features
• GaAs MMIC LNA-Switch-
Power Amp for 1.5 – 2.5 GHz
Transceiver Use
• LNA: 2.2 dB NF, 13 dB Ga @
1.9 GHz
• Switch: 55 dBm OIP @
1.9␣ GHz
• Power Amp: +4 dBm in,
+27.5 dBm out, 23.5 dB Gain,
35% ηadd @ 1.9 GHz
• 3 or 5 V Operation
• JEDEC Standard SSOP-28
Surface Mount Package
Plastic SSOP-28
Package Pin
Configuration
Applications
• Personal Communications
Systems (PCS)
• Cordless Telephone Systems
• 2400 MHz Wireless LANs
and ISM Band Spread
Spectrum Applications
HPMX
3003
YYWW
Functional Block Diagram
LNA out
C1
C2
PA in
(VG1)
5965-1403E
VD1
VG2
VD2
LNA in
SW1
Antenna
SW2
PA out
7-82
Description
Hewlett-Packard’s HPMX-3003
combines a Low Noise Amplifier,
GaAs MMIC switch, and 27.5 dBm
power amp in a single miniature
28 lead surface mount plastic
package. This RFIC would
typically serve as the “front end”
and power stage of a battery
operated wireless transceiver for
PCS or ISM band use. Each
section of the RFIC can also be
used independently.
The single-supply LNA makes use
of the low noise characteristics of
GaAs to create a matched, broad-
band amplifier with target perfor-
mance of 13 dB gain and 2.2 dB
noise figure. The switch provides
+55 dBm IP3 for linear operation.
The power amplifier produces up
to 820␣ mW with 35% power added
efficiency.
The HPMX-3003 is fabricated with
Hewlett-Packard’s GaAs MMIC
process, and features a nominal
0.5 micron recessed Schottky-
barrier-gate, gold metallization,
and silicon nitride passivation to
produce MMICs with superior
performance, uniformity and
reliability.
1 page  
HPMX-3003 Typical Performance
Standard test conditions apply unless otherwise noted. 2.4 GHz performance is performance in test circuit
shown in Figure 18. Some aspects of performance are determined by the test circuit impedances.
10
9
8
7
6
5
4
3
2
1
0
2.5
3
3.5 4 4.5 5 5.5 6
VOLTAGE (V)
20
15 2400 MHz
1900 MHz
10
5
0
2.5 3
3.5 4 4.5 5 5.5 6
VOLTAGE (V)
5
4
3 2400 MHz
2
1900 MHz
1
0
2.5 3
3.5 4 4.5 5 5.5 6
VOLTAGE (V)
Figure 2. LNA Current vs. Device
Voltage at 1900 MHz.
Figure 3. LNA Gain vs. Device Voltage
and Frequency.
Figure 4. LNA Noise Figure vs. Device
Voltage and Frequency.
8
7
6
5
4
3
2
1
0
-60 -40 -20 0 20 40 60
TEMPERATURE (°C)
80 100
Figure 5. LNA Current vs.
Temperature at 1900 MHz.
20
15
10
5
0
-60 -40 -20 0 20 40 60
TEMPERATURE (°C)
80 100
Figure 6. LNA Gain vs. Temperature
at 1900 MHz.
5
4
3
2
1
0
-60 -40 -20 0 20 40 60
TEMPERATURE (°C)
80 100
Figure 7. LNA Noise Figure vs.
Temperature at 1900 MHz.
12
10
Stg 2
8
6
4
Stg 1
2
2.5 3 3.5 4 4.5 5 5.5 6
VOLTAGE (V)
Figure 8. PA Current vs. Device
Voltage at 1900 MHz.
35
1900 MHz
30
25
2400 MHz
20
15
10
5
0
2.5 3
3.5 4 4.5 5 5.5 6
VOLTAGE (V)
Figure 9. PA Output Power vs. Supply
Voltage and Frequency.
50
40
1900 MHz
30
20
2400 MHz
10
0
2.5 3
3.5 4 4.5 5 5.5 6
VOLTAGE (V)
Figure 10. PA Power Added Efficiency
vs. Supply Voltage and Frequency.
7-86
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HPMX-3003-TR1.PDF ] | |
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