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Número de pieza | HMMC-2007 | |
Descripción | DC-8 GHz Terminated SPDT Switch | |
Fabricantes | Agilent(Hewlett-Packard) | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de HMMC-2007 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! DC – 8 GHz Terminated SPDT
Switch
Technical Data
HMMC-2007
Features
• Outputs Terminated in 50 Ω
When Off
• Frequency Range: DC-8 GHz
• Insertion Loss:
1.2dB@8␣ GHz
• Isolation:
>70 dB @ 45 MHz
>35 dB @ 8 GHz
• Return Loss:
25 dB (Both Input and
Selected Output)
18 dB Unselected Output
• Switching Speed:
<20 µs (10%-90% RF)
• P-1dB: 27 dBm
• Harmonics (DC Coupled):
<-80 dBc @ 10 dBm
Description
The HMMC-2007 is a GaAs mono-
lithic microwave integrated circuit
(MMIC) designed for low insertion
loss and high isolation from DC to
8 GHz. It is intended for use as a
general-purpose, single-pole,
double-throw (SPDT), absorptive
switch. Two series and two shunt
MESFETs per throw provide
1.4␣ dB maximum insertion loss
and 38 dB typical isolation at
6␣ GHz. HMMC-2007 chips use
through-substrate vias to provide
ground connections to the chip
backside and minimize the
number of wire bonds required.
5965-5451E
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
660 x 960 µm (25.9 x 37.8 mils)
± 10µm (± 0.4mils)
127 ± 15 µm (5.0 ± 0.6 mils)
120 x 120 µm (4.7 x 4.7 mils)
Absolute Maximum Ratings[1]
Symbol Parameters/Conditions
Units Min. Max.
Vsel Select Voltages 1 and 2
V -10.5 +10.5
Pin RF Input Power
dBm
27
Top Operating Temperature
°C -55 +125
TSTG
Storage Temperature
°C -65 +165
Tmax
Maximum Assembly Temp.
°C
+200
Punsel Power into Unselected Output dBm
27
Note:
1. Operation in excess of any one of these conditions may result in permanent
damage to this device. TA = 25°C except for Top, TSTG, and Tmax.
7-26
1 page HMMC-2007 Typical Performance
00
-1.0 S21-ON, S31-ON
-2.0
-20
S21-OFF, S31-OFF
-40
-3.0 -60
-4.0 -80
-5.0
0
5
FREQUENCY (GHz)
Figure 2. Insertion Loss[1] vs.
Frequency.
10
-100
0
5
FREQUENCY (GHz)
10
Figure 3. Input-to-Output Isolation[1]
vs. Frequency.
0
-10
-20 S33
-30
S22
-40
-50
0 5 10
FREQUENCY (GHz)
Figure 5. Output Return Loss[1] vs.
Frequency.
0
-1 1 GHz
-2
10 MHz
-3
-4
-5
10 15 20 25
POWER INPUT (dBm)
Figure 6. Gain Compression vs.
Power Input.
30
0
-10
-20
S11
-30
-40
-50
0 5 10
FREQUENCY (GHz)
Figure 4. Input Return Loss[1] vs.
Frequency.
Note:
1. Data taken with the device mounted in modular breadboard package.
7-30
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet HMMC-2007.PDF ] |
Número de pieza | Descripción | Fabricantes |
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