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PDF HMMC-2006 Data sheet ( Hoja de datos )
| Número de pieza | HMMC-2006 | |
| Descripción | DC-6 GHz Unterminated SPDT Switch | |
| Fabricantes | Agilent(Hewlett-Packard) | |
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DC – 6 GHz Unterminated SPDT
Switch
Technical Data
HMMC-2006
Features
• Frequency Range: DC-6 GHz
• Insertion Loss:
<1dB @ 6 GHz
• Isolation:
>70 dB @ 45 MHz
>35 dB @ 6 GHz
• Return Loss: >12 dB
(Both Input & Output)
• Switching Speed: <1 ns
• P-1dB:
23 dBm @ 50 MHz
>27dBm @ 6 GHz
• Harmonics: <-25 dBc @
20␣ dBm (DC coupled)
Description
The HMMC-2006 is a GaAs
monolithic microwave integrated
circuit (MMIC) designed for low
insertion loss and high isolation
from DC to 6 GHz. It is intended
for use as a general-purpose,
singlepole, double-throw (SPDT)
switch. One series and two shunt
MESFETs per throw provide
1.2␣ dB maximum insertion loss
and 35 dB minimum isolation at
6␣ GHz. HMMC-2006 chips use
through-substrate vias to provide
ground connections to the chip
backside and minimize the
number of wire bonds required.
The HMMC-2006 is also available
in an 8-lead flatpack (1GG7-4201).
RF
OUT2
SEL1
SEL2
RF
OUT1
Chip ID
RF
IN
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
960 x 1070 µm (37.8 x 42.1 mils)
+0, -10 µm (+0, -0.4 mils)
127 ± 15 µm (5.0 ± 0.6 mils)
80 x 80 µm (3.2 x 3.2 mils), or larger
Absolute Maximum Ratings[1]
Symbol Parameters/Conditions
Units Min.
Max.
Vsel Select Voltages 1 and 2
V -12 +3
Pin RF Input Power
Top Operating Temperature
dBm
30
°C -55 +125
TSTG
Storage Temperature
°C -65 +165
Tmax
Maximum Assembly Temp.
(for 60 seconds max.)
°C
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent
damage to this device. TA = 25°C except for Tch, TSTG, and Tmax.
5965-9071E
7-20
1 page  
HMMC-2006 Typical Performance
-40
S21-ON
-50
-14
-18
-60 -22
S11
S22
-70
-80
0
24
FREQUENCY (GHz)
6
Figure 2. Insertion Loss[1] vs.
Frequency.
-26
-30
0
24
FREQUENCY (GHz)
6
Figure 3. Input and Output (On
Throw) Return Loss[1] vs. Frequency.
-40
S21-OFF
-50
-60
S21-ON
-70
-80
0
24
FREQUENCY (GHz)
6
Figure 4. Input-to-Output Isolation[1]
vs. Frequency.
-40
S23
-50
-60
-70
-80
024 6
FREQUENCY (GHz)
Figure 5. Output-to-Output Isolation[2]
vs. Frequency.
Notes:
1. Wafer-probed measurements
2. Calculated from wafer-probed measurements
7-24
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HMMC-2006.PDF ] | |
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