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PDF HUF76112SK8 Data sheet ( Hoja de datos )

Número de pieza HUF76112SK8
Descripción 7.5A/ 30V/ 0.026 Ohm/ N-Channel/ Logic Level Power MOSFET
Fabricantes Intersil Corporation 
Logotipo Intersil Corporation Logotipo



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TM
Data Sheet
HUF76112SK8
April 2000 File Number 4834.1
7.5A, 30V, 0.026 Ohm, N-Channel, Logic
Level Power MOSFET
The HUF76112SK8 is an Application-Specific MOSFET
optimized for switching when used as the upper switch in
synchronous buck applications. The low gate charge and low
input capacitance results in lower driver and lower switching
losses, thereby increasing the overall system efficiency.
Symbol
SOURCE (1)
SOURCE (2)
SOURCE (3)
GATE (4)
DRAIN (8)
DRAIN (7)
DRAIN (6)
DRAIN (5)
Packaging
SO8 (JEDEC MS-012AA)
BRANDING DASH
1
2
34
5
Features
• 7.5A, 30V
- rDS(ON) = 0.026Ω, VGS = 10V
- rDS(ON) = 0.033Ω, VGS = 5V
• PWM Optimized for Synchronous Buck Applications
• Fast Switching
• Low Gate Charge
- Qg Total 15nC (Typ)
• Low Capacitance
- CISS 725pF (Typ)
- CRSS 36pF (Typ)
Ordering Information
PART NUMBER
PACKAGE
BRAND
HUF76112SK8
MS-012AA
76112SK8
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the HUF76112SK8 in tape and reel, e.g., HUF76112SK8T.
Absolute Maximum Ratings TA = 25oC, Unless Otherwise Specified
SYMBOL
PARAMETER
HUF76112SK8
UNITS
VDSS
VDGR
VGS
ID
ID
IDM
PD
Drain to Source Voltage (Note 1)
Drain to Gate Voltage (RGS = 20k) (Note 1)
Gate to Source Voltage
Drain Current
Continuous
Continuous
(TA
(TA
=
=
2150o0CoC, V, VGGSS==105VV))
(Figure 2)
(Note 2)
(Note
2)
Pulsed Drain Current
Power Dissipation (Note 2)
Derate Above 25oC
TJ, TSTG
Operating and Storage Temperature
Maximum Temperature for Soldering
TL
Tpkg
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
THERMAL SPECIFICATIONS Thermal Resistance Junction to Ambient
Measured using FR-4 board with 0.76 in2 (490.3 mm2) copper pad at 10
second.
RθJA
Measured using FR-4 board with 0.054 in2 (34.8 mm2) copper pad at 1000
seconds. (Figure 23)
Measured using FR-4 board with 0.0115 in2 (7.42 mm2) copper pad at 1000
seconds. (Figure 23)
30
30
±16
7.5
4.0
Figure 4
2.5
20
-55 to 150
300
260
50
152
189
V
V
V
A
A
A
W
mW/oC
oC
oC
oC
oC/W
oC/W
oC/W
NOTES:
1. TJ = 25oC to 125oC.
2. RθJA = 50 oC/W
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
UltraFET® is a registered trademark of Intersil Corporation.

1 page




HUF76112SK8 pdf
HUF76112SK8
Typical Performance Curves (Continued)
1.2
VGS = VDS, ID = 250µA
1.2
ID = 250µA
1.1
1.0
0.8 1.0
0.6
-80
-40 0
40 80 120
TJ, JUNCTION TEMPERATURE (oC)
160
FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
2000
1000
CISS = CGS + CGD
COSS CDS + CGD
100
CRSS = CGD
VGS = 0V, f = 1MHz
20
0.1 1.0
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
30
FIGURE 13. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
80
VGS = 5V, VDD = 15V, ID = 4.0A
td(OFF)
60
40
tr
tf
20
td(ON)
0
0 10 20 30 40 50
RGS, GATE TO SOURCE RESISTANCE ()
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE
5
0.9
-80
-40 0 40 80 120
TJ, JUNCTION TEMPERATURE (oC)
160
FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
10
VDD = 15V
8
6
4
WAVEFORMS IN
2 DESCENDING ORDER:
ID = 7.5A
ID = 1A
0
0 3 6 9 12 15
Qg, GATE CHARGE (nC)
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 14. GATE CHARGE WAVEFORMS FOR CONSTANT
GATE CURRENT
120
VGS = 10V, VDD = 15V, ID = 7.5A
100
80
td(OFF)
60
40
tf
tr
20
0
0
td(ON)
10 20 30 40
RGS, GATE TO SOURCE RESISTANCE ()
50
FIGURE 16. SWITCHING TIME vs GATE RESISTANCE

5 Page





HUF76112SK8 arduino
HUF76112SK8
MS-012AA
8 LEAD JEDEC MS-012AA SMALL OUTLINE PLASTIC PACKAGE
EA
E1 A1
e
D
b
h x 45o
c
L
0.060
1.52
0o- 8o
0.004 IN
0.10 mm
0.050
1.27
0.155
4.0
0.275
7.0
0.024
0.6
MINIMUM RECOMMENDED FOOTPRINT FOR
SURFACE-MOUNTED APPLICATIONS
1.5mm
DIA. HOLE
MS-012AA
12mm TAPE AND REEL
12mm
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
0.0532 0.0688 1.35
1.75
-
A1
0.004
0.0098 0.10
0.25
b
0.013
0.020
0.33
0.51
-
-
c
0.0075 0.0098 0.19
0.25
-
D
0.189
0.1968 4.80
5.00
2
E
0.2284 0.244
5.80
6.20
-
E1 0.1497 0.1574 3.80 4.00
e 0.050 BSC
1.27 BSC
3
-
H
0.0099 0.0196 0.25
0.50
-
L
0.016
0.050
0.40
1.27
4
NOTES:
1. All dimensions are within allowable dimensions of Rev. C of
JEDEC MS-012AA outline dated 5-90.
2. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.006 inches (0.15mm) per side.
3. Dimension “E1” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 0.010 inches
(0.25mm) per side.
4. “L” is the length of terminal for soldering.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. Controlling dimension: Millimeter.
7. Revision 8 dated 5-99.
4.0mm
USER DIRECTION OF FEED
2.0mm
1.75mm
CL
COVER TAPE
8.0mm
40mm MIN.
ACCESS HOLE
18.4mm
330mm
13mm
50mm
GENERAL INFORMATION
1. 2500 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION “A” SPECIFICATIONS.
11
12.4mm

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