PDF ADG758 Data sheet ( Hoja de datos )

Número de pieza	ADG758
Descripción	3 ohm/ 4-/8-Channel Multiplexers in Chip Scale Package
Fabricantes	Analog Devices
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No Preview Available ! a FEATURES 1.8 V to 5.5 V Single Supply ؎2.5 V Dual Supply 3 ⍀ ON Resistance 0.75 ⍀ ON Resistance Flatness 100 pA Leakage Currents 14 ns Switching Times Single 8-to-1 Multiplexer ADG758 Differential 4-to-1 Multiplexer ADG759 20-Lead 4 mm ؋ 4 mm Chip Scale Package Low Power Consumption TTL-/CMOS-Compatible Inputs For Functionally Equivalent Devices in 16-Lead TSSOP Package, See ADG708/ADG709 APPLICATIONS Data Acquisition Systems Communication Systems Relay Replacement Audio and Video Switching Battery-Powered Systems 3 ⍀, 4-/8-Channel Multiplexers in Chip Scale Package ADG758/ADG759 FUNCTIONAL BLOCK DIAGRAMS ADG758 ADG759 S1 S1A DA S4A D S1B DB S8 S4B 1 OF 8 DECODER 1 OF 4 DECODER A0 A1 A2 EN A0 A1 EN GENERAL DESCRIPTION The ADG758 and ADG759 are low voltage, CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG758 switches one of eight inputs (S1–S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG759 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF. Low power consumption and an operating supply range of 1.8 V to 5.5 V make the ADG758 and ADG759 ideal for battery-powered, portable instruments. All channels exhibit break-before-make switching action preventing momentary shorting when switch- ing channels. These switches are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low ON resistance and leakage currents. ON resistance is in the region of a few ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either multiplexers or demultiplexers and have an input signal range that extends to the supplies. The ADG758 and ADG759 are available in 20-lead chip scale packages. PRODUCT HIGHLIGHTS 1. Small 20-Lead 4 mm × 4 mm Chip Scale Packages (CSP). 2. Single/Dual Supply Operation. The ADG758 and ADG759 are fully speciﬁed and guaranteed with 3 V and 5 V single- supply and ± 2.5 V dual-supply rails. 3. Low RON (3 Ω Typical). 4. Low Power Consumption (<0.01 µW). 5. Guaranteed Break-Before-Make Switching Action. REV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002 1 page ADG758/ADG759 ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C, unless otherwise noted.) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Digital Inputs2 . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Chip Scale Package, θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 32°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this speciﬁcation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG758/ADG759 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE Table I. ADG758 Truth Table A2 A1 XX 00 00 01 01 10 10 11 11 X = Don’t Care A0 X 0 1 0 1 0 1 0 1 EN Switch Condition 0 NONE 11 12 13 14 15 16 17 18 Table II. ADG759 Truth Table A1 A0 XX 00 01 10 11 X = Don’t Care EN ON Switch Pair 0 NONE 11 12 13 14 PIN CONFIGURATIONS EN 1 VSS 2 S1 3 S2 4 S3 5 20 19 18 17 16 PIN 1 IDENTIFIER ADG758 TOP VIEW (Not to Scale) 15 GND 14 VDD 13 S5 12 S6 11 S7 6 7 8 9 10 NC = NO CONNECT EXPOSED PAD TIED TO SUBSTRATE, VSS EN 1 VSS 2 S1A 3 S2A 4 S3A 5 20 19 18 17 16 PIN 1 IDENTIFIER ADG759 TOP VIEW (Not to Scale) 15 GND 14 VDD 13 S1B 12 S2B 11 S3B 6 7 8 9 10 NC = NO CONNECT EXPOSED PAD TIED TO SUBSTRATE, VSS Model ADG758BCP ADG759BCP Temperature Range –40°C to +85°C –40°C to +85°C ORDERING GUIDE Package Description 20-Lead Chip Scale Package (CSP) 20-Lead Chip Scale Package (CSP) Package Option CP-20 CP-20 REV. A –5– 5 Page ADG758/ADG759 VDD VSS 3V VDD A2 A1 VSS S1 A0 S2 THRU S8 ADG758* VS ENABLE DRIVE (VIN) 0V V0 EN D VOUT OUTPUT VIN 50⍀ GND RL 300⍀ CL 35pF 0V 50% 50% 0.9V0 tOFF (EN) 0.9V0 tON (EN) SIMILAR CONNECTION FOR ADG759 Test Circuit 7. Enable Delay, tON (EN), tOFF (EN) RS VS VIN VDD VSS A2 VDD VSS A1 A0 ADG758 SD EN GND CL VOUT 1nF 3V LOGIC INPUT (VIN) 0V VOUT QINJ = CL ؋ ⌬VOUT ⌬VOUT SIMILAR CONNECTION FOR ADG759 Test Circuit 8. Charge Injection VDD 0.1␮F VSS 0.1␮F 2.4V VDD A2 A1 S A0 VSS D EN GND 50⍀ NETWORK ANALYZER 50⍀ VS VOUT RL 50⍀ OFF ISOLATION = 20 LOG VOUT VS Test Circuit 9. OFF Isolation VDD 0.1␮F VSS 0.1␮F NETWORK ANALYZER 50⍀ VS A2 VDD A1 VSS EN A0 ADG758 50⍀ S1 D S2 S8 GND 2.4V NETWORK ANALYZER VOUT RL 50⍀ VDD 0.1␮F VSS 0.1␮F 2.4V VDD A2 A1 S A0 VSS D EN GND NETWORK ANALYZER 50⍀ VS VOUT RL 50⍀ INSERTION LOSS = 20 LOG VOUT WITH SWITCH VOUT WITHOUT SWITCH Test Circuit 11. Bandwidth Power-Supply Sequencing When using CMOS devices, care must be taken to ensure correct power-supply sequencing. Incorrect power-supply sequencing can result in the device being subjected to stresses beyond the maximum ratings listed in the data sheet. Digital and analog inputs should always be applied after power supplies and ground. For single-supply operation, VSS should be tied to GND as close to the device as possible. *SIMILAR CONNECTION FOR ADG759 CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG VOUT VS Test Circuit 10. Channel-to-Channel Crosstalk REV. A –11– 11 Page

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