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PDF ADG609 Data sheet ( Hoja de datos )
| Número de pieza | ADG609 | |
| Descripción | 3 V/5 V/ 4/8 Channel High Performance Analog Multiplexers | |
| Fabricantes | Analog Devices | |
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a
3 V/5 V, 4/8 Channel High
Performance Analog Multiplexers
ADG608/ADG609
FEATURES
+3 V, +5 V, ؎5 V Power Supplies
VSS to VDD Analog Signal Range
Low On Resistance (30 ⍀ max)
Fast Switching Times
tON 75 ns max
tOFF 45 ns max
Low Power Dissipation (1.5 W max)
Break-Before-Make Construction
ESD > 5000 V as per Military Standard 3015.7
TTL and CMOS Compatible Inputs
APPLICATIONS
Automatic Test Equipment
Data Acquisition Systems
Communication Systems
Avionics and Military Systems
Microprocessor Controlled Analog Systems
Medical Instrumentation
Battery Powered Instruments
Remote Powered Equipment
Compatible with ؎5 V DACs and ADCs such as
AD7840/8, AD7870/1/2/4/5/6/8
GENERAL DESCRIPTION
The ADG608 and ADG609 are monolithic CMOS analog mul-
tiplexers comprising eight single channels and four differential
channels respectively, fully specified for ± 5 V, +5 V and +3 V
power supplies. The ADG608 switches one of eight inputs to a
common output as determined by the 3-bit binary address lines
A0, A1 and A2. The ADG609 switches one of four differential
inputs to a common differential output as determined by the
2-bit binary address lines A0 and A1. An EN input on both de-
vices is used to enable or disable the device. When disabled, all
channels are switched OFF. All the address and enable inputs
are TTL compatible over the full specified operating tempera-
ture range, making the parts suitable for bus-controlled systems
such as data acquisition systems, process controls, avionics and
ATEs since the TTL compatible address inputs simplify the digital
interface design and reduce the board space requirements.
The ADG608/ADG609 are designed on an enhanced LC2MOS
process that provides low power dissipation yet gives high
switching speed and low on resistance. Each channel conducts
equally well in both directions when ON and has an input signal
range which extends to the supplies. In the OFF condition, sig-
nal levels up to the supplies are blocked. All channels exhibit
break-before-make switching action preventing momentary
shorting when switching channels. Inherent in the design is low
charge injection for minimum transients when switching the
digital inputs.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
FUNCTIONAL BLOCK DIAGRAMS
ADG608
S1
ADG609
S1A
S4A
DA
D
S1B
DB
S8 S4B
1 OF 8
DECODER
1 OF 4
DECODER
A0 A1 A2 EN
A0 A1 EN
The ability to operate from single +3 V, +5 V or ± 5 V bipolar
supplies makes the ADG608 and ADG609 perfect for use in
battery operated instruments and with the new generation of
DACs and ADCs from Analog Devices. The use of 5 V sup-
plies and reduced operating currents gives much lower power
dissipation than devices operating from ± 15 V supplies.
PRODUCT HIGHLIGHTS
1. Extended Signal Range
The ADG608/ADG609 are fabricated on an enhanced
LC2MOS process giving an increased signal range which
extends to the supplies.
2. Low Power Dissipation
3. Low RON
4. Fast Switching Times
5. Break-Before-Make Switching
Switches are guaranteed break-before-make so that input
signals are protected against momentary shorting.
6. Single/Dual Supply Operation
ORDERING GUIDE
Model
Temperature Range Package Option*
ADG608BN
ADG608BR
ADG608BRU
ADG608TRU
ADG609BN
ADG609BR
ADG609BRU
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
N-16
R-16A
RU-16
RU-16
N-16
R-16A
RU-16
*N = Plastic DIP; RU = Thin Shrink Small Outline Package (TSSOP);
R = 0.15" Small Outline IC (SOIC).
© Analog Devices, Inc., 1995
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
Fax: 617/326-8703
1 page  
ADG608/ADG609
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Analog, Digital Inputs2 . . . . . . . . . . . . . . –0.3 V to VDD + 2 V
or 20 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . – 55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
SOIC Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
TSSOP Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5000 V
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating may be applied at any one time.
2Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should
be limited to the maximum ratings given.
Table I. ADG608 Truth Table
Table II. ADG609 Truth Table
A2 A1
XX
00
00
01
01
10
10
11
11
X = Don’t Care
A0
X
0
1
0
1
0
1
0
1
EN ON SWITCH
0 NONE
11
12
13
14
15
16
17
18
A1 A0
XX
00
01
10
11
X = Don’t Care
PIN CONFIGURATIONS
EN ON SWITCH PAIR
0 NONE
11
12
13
14
DIP/SOIC/TSSOP
DIP/SOIC/TSSOP
A0 1
16 A1
EN 2
15 A2
VSS 3
14 GND
S1 4 ADG608 13 VDD
TOP VIEW
S2 5 (Not to Scale) 12 S5
S3 6
11 S6
S4 7
D8
10 S7
9 S8
A0 1
16 A1
EN 2
15 GND
VSS 3
14 VDD
S1A 4 ADG609 13 S1B
TOP VIEW
S2A 5 (Not to Scale) 12 S2B
S3A 6
11 S3B
S4A 7
10 S4B
DA 8
9 DB
REV. A
–5–
5 Page 
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
ADG608/ADG609
16-Pin Plastic (N-16)
16
PIN 1
1
0.210
(5.33)
0.200 (5.05)
0.125 (3.18)
0.022 (0.558)
0.014 (0.356)
0.840 (21.33)
0.745 (18.93)
9
0.280 (7.11)
0.240 (6.10)
8
0.060 (1.52)
0.015 (0.38)
0.100
(2.54)
BSC
0.150
(3.81)
0.070 (1.77)
0.045 (1.15)
SEATING
PLANE
0.325 (8.25)
0.300 (7.62)
0.195 (4.95)
0.115 (2.93)
0.015 (0.381)
0.008 (0.204)
16-Pin SOIC (R-16A)
0.3937 (10.00)
0.3859 (9.80)
0.1574 (4.00) 16
0.1497 (3.80) 1
9 0.2440 (6.20)
8 0.2284 (5.80)
0.0098 (0.25)
0.0040 (0.10)
PIN 1
0.0688 (1.75)
0.0532 (1.35)
0.0196 (0.50)
x 45°
0.0099 (0.25)
0.0500
SEATING (1.27)
PLANE BSC
0.0192 (0.49)
0.0138 (0.35)
8°
0.0099 (0.25) 0° 0.0500 (1.27)
0.0075 (0.19) 0.0160 (0.41)
16-Pin TSSOP (RU-16)
0.201 (5.10)
0.193 (4.90)
16 9
1
8
0.006 (0.15)
0.002 (0.05)
PIN 1
0.0256
SEATING (0.65)
PLANE BSC
0.0118 (0.30)
0.0075 (0.19)
0.0433
(1.10)
MAX
8°
0°
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
REV. A
–11–
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ADG609.PDF ] | |
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