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PDF ADT7301 Data sheet ( Hoja de datos )

Número de pieza ADT7301
Descripción 13-Bit/ 0.5C Accurate/ MicroPower Digital Temperature Sensor in 6-Lead SOT-23
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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13-Bit, ±0.5°C Accurate, MicroPower Digital
Temperature Sensor in 6-Lead SOT-23
Preliminary Technical Data
ADT7301
FEATURES
13-bit temperature-to-digital converter
−40°C to +150°C operating temperature range
±0.5°C typical accuracy
0.03125°C temperature resolution
Shutdown current of 1 µA
Power dissipation of 0.631 mW at VDD = 3.3 V
SPI- and DSP-compatible serial interface
Shutdown mode
Space-saving SOT-23 and MSOP packages
APPLICATIONS
Medical equipment
Automotive:
Environmental controls
Oil temperature
Hydraulic systems
Cell phones
Hard disk drives
Personal computers
Electronic test equipment
Office equipment
Domestic appliances
Process control
GENERAL DESCRIPTION
The ADT7301 is a complete temperature monitoring system
available in SOT-23 and MSOP packages. It contains a band gap
temperature sensor and a 13-bit ADC to monitor and digitize
the temperature reading to a resolution of 0.03125°C.
The ADT7301 has a flexible serial interface that allows easy
interfacing to most microcontrollers. The interface is compat-
ible with SPI®, QSPI™, and MICROWIRE™ protocols as well as
DSPs. The part features a standby mode that is controlled via
the serial interface. The ADT7301’s wide supply voltage range,
low supply current, and SPI compatible interface make it ideal
for a variety of applications, including personal computers,
office equipment, automotive, and domestic appliances. The
ADT7301 is rated for operation over the -40°C to +150°C
temperature range. It is not recommended to operate the device
at temperatures above +125°C for greater than a total of 5%
(5,000 hours) of the lifetime of the device. Any exposure
beyond this limit will affect device reliability.
Rev. PrJ
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
FUNCTIONAL BLOCK DIAGRAM
GND
BAND GAP
TEMPERATURE
SENSOR
ADT7301
13-BIT
ANALOG/DIGITAL
CONVERTER
TEMPERATURE
VALUE
REGISTER
VDD
SERIAL
BUS
INTERFACE
CS
SCLK
DIN
DOUT
Figure 1. Functional Block Diagram
PRODUCT HIGHLIGHTS
1. The ADT7301 has an on-chip temperature sensor that
allows an accurate measurement of the ambient tempera-
ture. The measurable temperature range is −40°C to
+150°C.
2. Supply voltage of 2.7 V to 5.5 V.
3. Space-saving 6-lead SOT-23 and 8-lead MSOP packages.
4. Temperature accuracy of ±0.5°C.
5. 13-bit temperature reading to 0.03125°C resolution.
6. The ADT7301 features a shutdown mode that reduces the
power consumption to 4.88 µW with VDD = 3.3 V @ 1 SPS.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.

1 page




ADT7301 pdf
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 3. ADT7301 Stress Ratings
Parameter
Rating
VDD to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Operating Temperature Range1
Storage Temperature Range
Junction Temperature
6-Lead SOT-23 (RJ-6)
Power Dissipation2
Thermal Impedance
θJA, Junction-to-Ambient (still air)
8-Lead MSOP (RM-8)
Power Dissipation2
Thermal Impedance4
θJA, Junction-to-Ambient (still air)
θJC, Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-up Rate
Ramp-down Rate
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +150°C
−65°C to +150°C
+150°C
WMAX = (TJMAX - TA3)/θJA
190.4°C/W
WMAX = (TJMAX - TA3)JA
205.9°C/W
43.74°C/W
+220°C (−0/+5°C)
10 s to 20 s
2°C/s to 3°C/s
−6°C/sec
1It is not recommended to operate the ADT7301 at temperatures above 125°C
for greater than a total of 5% of the lifetime of the device. Any exposure
beyond this limit will affect device reliability.
2Values relate to package being used on a standard 2-layer PCB. Reference
Figure 3 for a plot of maximum power dissipation versus ambient
temperature (TA).
3TA = ambient temperature
4Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB mounted
components.
ADT7301
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability
1.2
1.0
0.8
SOT-23
0.6
0.4 MSOP
0.2
0
TEMPERATURE (°C)
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. PrJ | Page 5 of 14

5 Page





ADT7301 arduino
Preliminary Technical Data
#include <16F873.h>
#device adc=8
#use delay(clock=4000000)
#fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP
#BIT CKP = 0x14.4
#define CS PIN_A1
void main(){
int MSByte,LSByte;
long int ADC_Temp_Code;
float TempVal,ADC_Temp_Code_dec;
setup_spi(spi_master);
CKP = 1;
do{
delay_ms(10);
Output_low(CS);
delay_us(10);
MSByte = SPI_Read(0);
LSByte = SPI_Read(0);
delay_us(10);
Output_High(CS);
MSByte = 0x03;
LSByte = 0x20;
ADC_Temp_Code = make16(MSByte,LSByte);
ADC_Temp_Code_dec = (float)ADC_Temp_Code;
if ((0x2000 & ADC_Temp_Code) == 0x2000)
{
TempVal = (ADC_Temp_Code_dec - 16384)/32;
}
else
{
TempVal = (ADC_Temp_Code_dec/32);
}
}while(True);
}
ADT7301
//Pic is set up as Master device.
//Idle state of clock is high.
//Allow time for conversions.
//Pull CS low.
//CS to SCLK setup time.
//The first byte is clocked in.
//The second byte is clocked in.
//SCLK to CS setup time.
//Bring CS high.
//16bit ADC code is stored ADC_Temp_Code.
//Covert to float for division.
//Check sign bit for negative value.
//Conversion formula if negative temperature.
//Conversion formula if positive temperature.
//Temperature value stored in TempVal.
Rev. PrJ | Page 11 of 14

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