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BC856A Datasheet دیتاشیت PDF دانلود

دیتاشیت - Diotec Semiconductor - Surface mount General Purpose Si-Epitaxial-Planar Transistors

شماره قطعه BC856A
شرح مفصل Surface mount General Purpose Si-Epitaxial-Planar Transistors
تولید کننده Diotec Semiconductor 
آرم Diotec Semiconductor 


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BC856A شرح
BC856 ... BC860
BC856 ... BC860
PNP
Surface Mount General Purpose Si-Epi-Planar Transistors
Si-Epi-Planar Universaltransistoren für die Oberflächenmontage
Version 2015-05-12
2.9 ±0.1
0.4+0.1
-0.05
3
Type
Code
1.1+0.1
-0.2
Power dissipation – Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
12
1.9±0.1
Dimensions - Maße [mm]
1=B 2=E 3=C
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
PNP
250 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (TA = 25°C)
Collector-Emitter-volt. – Kollektor-Emitter-Spannung
Collector-Base-voltage – Kollektor-Basis-Spannung
Emitter-Base-voltage – Emitter-Basis-Spannung
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (dc)
Peak Collector current – Kollektor-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
B open
E open
C open
- VCEO
- VCBO
- VEBO
Ptot
- IC
- ICM
Tj
TS
Grenzwerte (TA = 25°C)
BC856
BC857
BC860
BC858
BC859
65 V
45 V
30 V
80 V
50 V
30 V
5V
250 mW 1)
100 mA
200 mA
-55...+150°C
-55…+150°C
Characteristics (Tj = 25°C)
DC current gain – Kollektor-Basis-Stromverhältnis
- VCE = 5 V, - IC = 10 µA
Group A
Group B
Group C
HFE
hFE
hFE
- VCE = 5 V, - IC = 2 mA
Group A
Group B
Group C
HFE
hFE
hFE
Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung 2)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
- VCEsat
- VCEsat
Base-Emitter saturation voltage – Basis-Sättigungsspannung 2)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
- VBEsat
- VBEsat
Kennwerte (Tj = 25°C)
Min.
Typ.
Max.
– 90 –
– 150 –
– 270 –
125 180 250
220 290 475
420 520 800
– – 300 mV
– – 650 mV
– 700 mV –
– 900 mV –
1 Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
2 Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
© Diotec Semiconductor AG
http://www.diotec.com/
1

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