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PDF BC846BW Data sheet ( Hoja de datos )
| Número de pieza | BC846BW | |
| Descripción | Surface mount Si-Epitaxial PlanarTransistors | |
| Fabricantes | Diotec Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de BC846BW (archivo pdf) en la parte inferior de esta página. Total 2 Páginas | ||
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BC 846W ... BC 850W
General Purpose Transistors
NPN
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
NPN
2±0.1
0.3 3
Type
Code
12
1.3
1±0.1
Dimensions / Maße in mm
1=B 2=E 3=C
Power dissipation – Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
200 mW
SOT-323
0.01 g
Maximum ratings (TA = 25/C)
Collector-Emitter-voltage
B open
Collector-Base-voltage
E open
Emitter-Base-voltage
C open
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (DC)
Peak Collector current – Kollektor-Spitzenstrom
Peak Base current – Basis-Spitzenstrom
Peak Emitter current – Emitter-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
VCE0
VCB0
VEB0
Ptot
IC
ICM
IBM
- IEM
Tj
TS
Grenzwerte (TA = 25/C)
BC 846W BC 847W BC 848W
BC 850W BC 849W
65 V 45 V 30 V
80 V 50 V 30 V
6V 5V
200 mW 1)
100 mA
200 mA
200 mA
200 mA
150/C
- 65…+ 150/C
Characteristics (Tj = 25/C)
DC current gain – Kollektor-Basis-Stromverhältnis 2)
VCE = 5 V, IC = 10 :A
VCE = 5 V, IC = 2 mA
h-Parameters at VCE = 5V, IC = 2 mA, f = 1 kHz
Small signal current gain – Stromverstärkung
Input impedance – Eingangs-Impedanz
Output admittance – Ausgangs-Leitwert
Reverse voltage transfer ratio
Spannungsrückwirkung
hFE
hFE
hfe
hie
hoe
hre
Group A
Kennwerte (Tj = 25/C)
Group B
Group C
typ. 90
110...220
typ. 150
200...450
typ. 270
420...800
typ. 220
1.6...4.5 kS
18 < 30 :S
typ.1.5 *10-4
typ. 330
3.2...8.5 kS
30 < 60 :S
typ. 2 *10-4
typ. 600
6...15 kS
60 < 110 :S
typ. 3 *10-4
1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
2) Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
12 01.11.2003
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet BC846BW.PDF ] | |
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