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BC818-16 fiches techniques PDF

Diotec Semiconductor - Surface mount Si-Epitaxial PlanarTransistors

Numéro de référence BC818-16
Description Surface mount Si-Epitaxial PlanarTransistors
Fabricant Diotec Semiconductor 
Logo Diotec Semiconductor 





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BC818-16 fiche technique
BC 817 / BC 818
General Purpose Transistors
NPN
Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage
NPN
2.9 ±0.1
0.4
3
Type
Code
1
1.9
2
1.1
Dimensions / Maße in mm
1=B 2=E 3=C
Power dissipation – Verlustleistung
Plastic case
Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
310 mW
SOT-23
(TO-236)
0.01 g
Maximum ratings (TA = 25/C)
Collector-Emitter-voltage
B open
Collector-Emitter-voltage
B shorted
Collector-Base-voltage
E open
Emitter-Base-voltage
C open
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (DC)
Peak Coll. current – Kollektor-Spitzenstrom
Peak Base current – Basis-Spitzenstrom
Peak Emitter current – Emitter-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
VCE0
VCES
VCB0
VEB0
Ptot
IC
ICM
IBM
- IEM
Tj
TS
Characteristics, Tj = 25/C
DC current gain – Kollektor-Basis-Stromverhältnis
VCE = 1 V, IC = 100 mA
VCE = 1 V, IC = 500 mA
VCE = 1 V, IC = 100 mA
BC817
BC818
Group -16
Group -25
Group -40
hFE
hFE
hFE
hFE
hFE
Grenzwerte (TA = 25/C)
BC 817
BC 818
45 V
25 V
50 V
30 V
50 V
30 V
5V
310 mW 1)
800 mA
1000 mA
200 mA
1000 mA
150/C
- 65…+ 150/C
Min.
Kennwerte, Tj = 25/C
Typ.
Max.
100 – 600
40 –
100 160 250
160 250 400
250 400 600
1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
6
01.11.2003

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