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PDF BD545A Data sheet ( Hoja de datos )

Número de pieza BD545A
Descripción NPN SILICON POWER TRANSISTORS
Fabricantes Power Innovations Limited 
Logotipo Power Innovations Limited Logotipo



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No Preview Available ! BD545A Hoja de datos, Descripción, Manual

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Copyright © 1997, Power Innovations Limited, UK
BD545, BD545A, BD545B, BD545C
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
q Designed for Complementary Use with the
BD546 Series
q 85 W at 25°C Case Temperature
q 15 A Continuous Collector Current
q Customer-Specified Selections Available
B
C
SOT-93 PACKAGE
(TOP VIEW)
1
2
E3
Pin 2 is in electrical contact with the mounting base.
MDTRAA
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
Collector-base voltage (IE = 0)
RATING
Collector-emitter voltage (IB = 0) (see Note 1)
Emitter-base voltage
Continuous collector current
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)
Operating free air temperature range
Operating junction temperature range
Storage temperature range
Lead temperature 3.2 mm from case for 10 seconds
BD545
BD545A
BD545B
BD545C
BD545
BD545A
BD545B
BD545C
NOTES: 1. These values apply when the base-emitter diode is open circuited.
2. Derate linearly to 150°C case temperature at the rate of 0.68 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 28 mW/°C.
SYMBOL
VCBO
VCEO
VEBO
IC
Ptot
Ptot
TA
Tj
Tstg
TL
VALUE
40
60
80
100
40
60
80
100
5
15
85
3.5
-65 to +150
-65 to +150
-65 to +150
260
UNIT
V
V
V
A
W
W
°C
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
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BD545A pdf
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BD545, BD545A, BD545B, BD545C
NPN SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93
ø 4,1
4,0
15,2
14,7
3,95
4,15
4,90
4,70
1,37
1,17
12,2 MAX.
16,2 MAX.
18,0 TYP.
31,0 TYP.
1
1,30
1,10
23
11,1
10,8
2,50 TYP.
0,78
0,50
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the mounting tab.
PRODUCT INFORMATION
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