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PDF IRF830A Data sheet ( Hoja de datos )

Número de pieza IRF830A
Descripción N-Channel Power MOSFET / Transistor
Fabricantes nELL 
Logotipo nELL Logotipo



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No Preview Available ! IRF830A Hoja de datos, Descripción, Manual

SEMICONDUCTOR
IRF830 Series RRooHHSS
Nell High Power Products
N-Channel Power MOSFET
(4.5A, 500Volts)
DESCRIPTION
The Nell IRF830 are N-Channel enhancement mode silicon
gate power field effect transistors. They are designed, tested
and guaranteed to withstand a specified level of energy in the
breakdown avalanche mode of operation.
They are designed as an extremely efficient and reliable
device for use in a wide variety of applications such as
switching regulators. convertors, UPS, switching mode power
supplies and drivers for high power bipolar switching
transistors requiring high speed and low gate drive power.
These transistors can be operated directly from integrated
circuits.
FEATURES
RDS(ON) = 1.5Ω @ VGS = 10V
Ultra low gate charge(38nC Max.)
Low reverse transfer capacitance
(CRSS = 68pF typical)
Fast switching capability
100% avalanche energy specified
Improved dv/dt capability
150°C operation temperature
D
GDS
TO-220AB
(IRF830A)
D (Drain)
G
(Gate)
S (Source)
PRODUCT SUMMARY
ID (A)
VDSS (V)
RDS(ON) (Ω)
QG(nC) max.
4.5
500
1.5 @ VGS = 10V
38
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise specified)
SYMBOL
PARAMETER
TEST CONDITIONS
VDSS
VDGR
Drain to Source voltage(Note 1)
Drain to Gate voltage
TJ=25°C to 150°C
RGS=20KΩ
VGS Gate to Source voltage
ID Continuous Drain Current
VGS=10V, TC=25°C
VGS=10V, TC=100°C
IDM Pulsed Drain current(Note 1)
IAR Repetitive avalanche current(Note 1)
EAR Repetitive avalanche energy(Note 1)
EAS Single pulse avalanche energy(Note 2)
lAR=4.5A, RGS=50Ω, VGS=10V
lAS=4.5A, L=24mH
dv/dt
Peak diode recovery dv/dt(Note 3)
Total power dissipation
PD
Derating factor above 25°C
TC=25°C
TJ Operation junction temperature
TSTG
Storage temperature
TL Maximum soldering temperature, for 10 seconds 1.6mm from case
Mounting torque, #6-32 or M3 screw
Note: 1.Repetitive rating: pulse width limited by junction temperature.
2.VDD = 50V, L=24mH, lAS=4.5A, RG =25Ω, starting TJ =25°C
3.ISD ≤ 4.5A, di/dt ≤ 75A/µs, VDD V(BR)DSS, starting TJ ≤ 150°C.
VALUE
500
500
±20
4.5
2.9
18
4.5
7.4
280
3.5
74
0.59
-55 to 150
-55 to 150
300
10 (1.1)
UNIT
V
A
mJ
mJ
V /ns
W
W /°C
ºC
lbf.in (N.m)
www.nellsemi.com
Page 1 of 7

1 page




IRF830A pdf
SEMICONDUCTOR
10
IRF830 Series RRooHHSS
Nell High Power Products
Fig.10 Maximum effective transient thermal impedance,
Junction-to-Case
1 D = 0.5
0.2
0.1
0.1 0.05
0.02
0.01
10-²
10-₅
10-
Single pulse
(Thermal response)
10-³
10-²
PDM
t1
t2
Notes:
1. Duty factor, D = t1/ t2
2. Peak TJ = PDM * Rth(j-c) +TC
0.1 1 10
Rectangular Pulse Duration , t1 (seconds)
Fig.11a. Switching time test circuit
Fig.11b. Switching time waveforms
VDS
VGS
RG
RD
D.U.T.
10V
Pulse width ≤ 1µs
Duty Factor ≤ 0.1%
+
- VDD
VDS
90%
10%
VGS
td(ON)
tR
td(OFF)
tF
Fig.12a. Unclamped lnductive test circuit
Fig.12b. Unclamped lnductive waveforms
VDS
L
RG
10V
tP
D.U.T.
lAS
0.01Ω
Vary tp to obtain required IAS
+
- VDD
A
BVDSS
lAS
VDD
www.nellsemi.com
Page 5 of 7
lD(t)
tp
VDS(t)
Time

5 Page










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