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PDF HLMP-D401 Data sheet ( Hoja de datos )
| Número de pieza | HLMP-D401 | |
| Descripción | LED Lamps | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HLMP-D401 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762,
HLMP-3862, HLMP-3962, HLMP-D401
T-13/4 (5 mm) Diffused LED Lamps
Data Sheet
Description
This family of T-13/4 tinted, diffused LED lamps is
widely used in general purpose indicator applications.
Diffusants, tints, and optical design are balanced to yield
superior light output and wide viewing angles. Several
intensity choices are available in each color for increased
design flexibility.
Device Selection Guide
Material/Color Part Number
GaP HER
GaP Yellow
GaP Orange
GaP Green
HLMP-3301
HLMP-3301-D00xx
HLMP-3301-F00xx
HLMP-3301-FG0xx
HLMP-3762
HLMP-3762-G00xx
HLMP-3401
HLMP-3401-E00xx
HLMP-3862
HLMP-D401
HLMP-D401-EF0xx
HLMP-3507
HLMP-3507-D00xx
HLMP-3507-EF0xx
HLMP-3962
HLMP-3962-F00xx
Luminous Intensity,
Iv (mcd) at 10mA
Min. Max.
6.1 -
2.4 -
6.1 -
6.1 15.5
9.7 -
9.7 -
6.5 -
6.5 -
10.3 -
6.1 -
3.8 9.7
4.7 -
4.7 -
7.6 19.1
12.0 -
12.0 -
Features
• High intensity
• Choice of 4 bright colors
– High Efficiency Red
– Orange
– Yellow
– High Performance Green
• Popular T-13/4 diameter package
• Selected minimum intensities
• Wide viewing angle
• General purpose leads
• Reliable and rugged
• Available on tape and reel
1 page  
T-13/4 High Efficiency Red, Orange Diffused Lamps
Figure 2. Forward current vs. forward voltage
characteristics
Figure 3. Relative luminous intensity vs.
DC forward current
Figure 4. Relative efficiency (luminous intensity per
unit current) vs. peak LED current
Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
Figure 6. Relative luminous intensity vs. angular displacement
5
5 Page 
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• Ifleadformingisrequiredbeforesoldering,caremustbe
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature.The solder
joint formed will absorb the mechanical stress of the
lead cutting from traveling to the LED chip die attach
and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mmbelowthebody(encapsulantepoxy)forthoseparts
without standoff.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Properhandlingisimperativetoavoidexcessivethermal
stresses to LED components when heated. Therefore,
the soldered PCB must be allowed to cool to room
temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
Wave Soldering
105 °C Max.
30 sec Max.
250 °C Max.
3 sec Max.
Manual Solder
Dipping
–
–
260 °C Max.
5 sec Max.
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 × 0.018 in.) (0.025 in) (0.039 to 0.043 in)
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 × 0.020 in.) (0.028 in) (0.041 to 0.045 in)
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
TURBULENT WAVE
250
200
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
150
FLUXING
100
50
30 PREHEAT
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0 10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 17. Recommended wave soldering profile
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN
AV02-1558EN - March 30, 2015
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet HLMP-D401.PDF ] | |
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