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PDF ACFL-5211T Data sheet ( Hoja de datos )
| Número de pieza | ACFL-5211T | |
| Descripción | Wide Operating Temperature 1MBd Digital Optocoupler | |
| Fabricantes | AVAGO | |
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ACFL-5211T
Automotive R2CouplerTM Wide Operating Temperature 1MBd Digital
Optocoupler in a Stretched 12-Pin Surface Mount Plastic Package
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The ACFL-5211T is an automotive grade dual channel, bi-
directional, high speed 1MBd digital optocoupler. The
stretched SO-12 stretched package outline is designed
to be compatible with standard surface mount processes
and occupies the same land area as the single channel
equivalent, ACPL-K43T, in stretched SO8 package.
This digital optocoupler uses an insulating layer between
the light emitting diode and an integrated photo detector
to provide electrical insulation between input and output.
Each channel is also galvanically isolated from the other
with no cross-talk.
Avago R2Coupler provides with reinforced insulation and
reliability that delivers safe signal isolation critical in auto-
motive and high temperature industrial applications
Functional Diagram
VCC1 1
VOUT1 2
GND1 3
AN2 4
CA2 5
CA2 6
12 CA1
11 AN1
10 VCC2
9 VOUT2
8 GND2
7 GND2
Truth Table
LED VO
ON LOW
OFF HIGH
Features
• Qualified to AEC Q100 Grade 1 Guidelines
• Wide Temperature Range: -40°C to +125°C
• Ultra low LED drive current for status feedback at IF =
0.8mA or 1.5mA
• High speed (1MBd) operation at IF = 10mA with low
propagation delay: 1µs (max.)
• Low standby leakage:
- ICCH: 2.5µA (max.)
- IOH: 5µA (max.)
• 30 kV/µs High Common-Mode Rejection at VCM = 1500
V (typ)
• Compact, Auto-Insertable Stretched SO12 Packages
• Worldwide Safety Approval:
- UL 1577 recognized, 5kVRMS/1 min.
- CSA Component Acceptance Notice#5A
- IEC/EN/DIN EN 60747-5-5
Applications
• Automotive Low Speed Digital Signal Isolation Interface
• Inverter Fault Feedback Signal Isolation
• Switching Power Supplies Feedback Circuit
Note: The connection of a 1 μF bypass capacitor between pins 1 and 3
and pins 8 and 10 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD. The components
featured in this datasheet are not to be used in military or aerospace applications or environments.
1 page  
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Junction Temperature
Lead Soldering Cycle
Temperature
Time
Average Forward Input Current
Peak Forward Input Current
(50% duty cycle, 1ms pulse width)
Peak Transient Input Current
(≤1µs pulse width, 300ps)
Reversed Input Voltage
Input Power Dissipation
Output Power Dissipation
Average Output Current
Peak Output Current
Supply Voltage
Output Voltage
Solder Reflow Temperature Profile
Recommended Operating Conditions
Parameter
Supply Voltages
Operating Temperature
Symbol
TS
TA
TJ
IF(avg)
IF(peak)
Min. Max. Units Condition
-55 150 °C
-40 125 °C
150 °C
260 °C
10 s
20 mA
40 mA
IF(trans)
100 mA
VR
PIN
PO
IO
IO(pk)
VCC1/VCC2
VOUT1/VOUT2
5V
30 mW
100 mW
8 mA
16 mA
-0.5 30 V
-0.5 20 V
See Reflow Temperature Profile
Symbol
VCC1/VCC2
TA
Min.
-40
Max. Units Note
20.0 V
125 °C
5
5 Page 
Thermal Resistance Measurement
The diagram of ACFL-5211T for measurement is shown in Figure 17. This is a multi-chip package with four heat sources,
the effect of heating of one die due to the adjacent dice are considered by applying the theory of linear superposition.
Here, one die is heated first and the temperatures of all the dice are recorded after thermal equilibrium is reached. Then,
the 2nd die is heated and all the dice temperatures are recorded and so on until the 4th die is heated. With the known
ambient temperature, the die junction temperature and power dissipation, the thermal resistance can be calculated.
The thermal resistance calculation can be cast in matrix form. This yields a 4 by 4 matrix for our case of two heat sources.
R11 R12 R13 R14
R21
R31
R22
R32
R23
R33
R24
R34
•
R41 R42 R43 R44
P1
P2
P3
=
P4
∆T1
∆T2
∆T3
∆T4
R11: Thermal Resistance of Die1 due to heating of Die1 (˚C/W)
R12: Thermal Resistance of Die1 due to heating of Die2 (˚C/W)
R13: Thermal Resistance of Die1 due to heating of Die3 (˚C/W)
R14: Thermal Resistance of Die1 due to heating of Die4 (˚C/W)
R21: Thermal Resistance of Die2 due to heating of Die1 (˚C/W)
R22: Thermal Resistance of Die2 due to heating of Die2 (˚C/W)
R23: Thermal Resistance of Die2 due to heating of Die3 (˚C/W)
R24: Thermal Resistance of Die2 due to heating of Die4 (˚C/W)
R31: Thermal Resistance of Die3 due to heating of Die1 (˚C/W)
R32: Thermal Resistance of Die3 due to heating of Die2 (˚C/W)
R33: Thermal Resistance of Die3 due to heating of Die3 (˚C/W)
R34: Thermal Resistance of Die3 due to heating of Die4 (˚C/W)
R41: Thermal Resistance of Die4 due to heating of Die1 (˚C/W)
R42: Thermal Resistance of Die4 due to heating of Die2 (˚C/W)
R43: Thermal Resistance of Die4 due to heating of Die3 (˚C/W)
R44: Thermal Resistance of Die4 due to heating of Die4 (˚C/W)
P1: Power dissipation of Die1 (W)
P2: Power dissipation of Die2 (W)
P3: Power dissipation of Die3 (W)
P4: Power dissipation of Die4 (W)
T1: Junction temperature of Die1 due to heat from all dice (°C)
T2: Junction temperature of Die2 due to heat from all dice (°C)
T3: Junction temperature of Die3 due to heat from all dice (°C)
T4: Junction temperature of Die4 due to heat from all dice (°C)
Ta: Ambient temperature.
∆T1: Temperature difference between Die1 junction and ambient (°C)
∆T2: Temperature deference between Die2 junction and ambient (°C)
∆T3: Temperature difference between Die3 junction and ambient (°C)
∆T4: Temperature deference between Die4 junction and ambient (°C)
T1 = (R11 x P1 + R12 x P2 + R13 x P3 + R14 x P4 ) + Ta -- (1)
T2 = (R21 x P1 + R22 x P2 + R23 x P3 + R24 x P4) + Ta -- (2)
T3 = (R31 x P1 + R32 x P2 + R33 x P3 + R34 x P4) + Ta -- (3)
T4= (R41 x P1 + R42 x P2 + R43 x P3 + R44 x P4 ) + Ta -- (4)
1
2
Die 1:
IC1
3
4
5
Die 2:
LED1
6
Die 4:
LED2
Die 3:
IC2
12
11
10
9
8
7
Figure 17. Diagram of ACFL-5211T for measurement
Measurement data on a low K (conductivity) board:
R11 = 181 °C/W
R21 = 103 °C/W
R31 = 82 °C/W
R41 = 110 °C/W
R12 = 91 °C/W
R22 = 232 °C/W
R32 = 97 °C/W
R42 = 86 °C/W
R13 = 85 °C/W
R23 = 109 °C/W
R33 = 180 °C/W
R43 = 101 °C/W
R14 = 112 °C/W
R24 = 91 °C/W
R34 = 91 °C/W
R44 = 277 °C/W
Measurement data on a high K (conductivity) board:
R11 = 117 °C/W
R21 = 37 °C/W
R31 = 35 °C/W
R41 = 47 °C/W
R12 = 42 °C/W
R22 = 161 °C/W
R32 = 53°C/W
R42 = 30 °C/W
R13 = 32 °C/W
R23 = 39 °C/W
R33 = 114 °C/W
R43 = 29 °C/W
R14 = 60 °C/W
R24 = 33 °C/W
R34 = 34 °C/W
R44 = 189 °C/W
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ACFL-5211T.PDF ] | |
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