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PDF NRVTS8120EMFS Data sheet ( Hoja de datos )
| Número de pieza | NRVTS8120EMFS | |
| Descripción | Very Low Leakage Trench-based Schottky Rectifier | |
| Fabricantes | ON Semiconductor | |
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NRVTS8120EMFS
Very Low Leakage
Trench-based Schottky
Rectifier
Features
• Fine Lithography Trench−based Schottky Technology for Very Low
Forward Voltage and Low Leakage
• Fast Switching with Exceptional Temperature Stability
• Low Power Loss and Lower Operating Temperature
• Higher Efficiency for Achieving Regulatory Compliance
• Low Thermal Resistance
• High Surge Capability
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Switching Power Supplies including Notebook / Netbook Adapters,
ATX and Flat Panel Display
• High Frequency and DC−DC Converters
• Freewheeling and OR−ing Diodes
• Reverse Battery Protection
• LED Lighting
• Instrumentation
Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
www.onsemi.com
TRENCH SCHOTTKY
RECTIFIERS
8 AMPERES
120 VOLTS
1,2,3
5,6
1
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
MARKING
DIAGRAM
A
A TE0812
A AYWWZZ
Not Used
C
C
TE0812
A
Y
W
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
ORDERING INFORMATION
Device
NRVTS8120EMFST1G
Package Shipping†
SO−8 FL
1500 /
(Pb−Free) Tape & Reel
NRVTS8120EMFST3G SO−8 FL
5000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 0
1
Publication Order Number:
NRVTS8120EMFS/D
1 page  
NRVTS8120EMFS
PACKAGE DIMENSIONS
D
2
D1
2X
0.20 C
A
B 2X
E1
2E
1 2 34
TOP VIEW
0.10 C
0.10 C
SIDE VIEW
A
DETAIL A
8X b
0.10 C A B
0.05 c L
1
e/2
e
4
K
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
c
4X
q
A1
DETAIL A
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.495
4.560
2X
1.530
MILLIMETERS
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.00 −−− 0.05
b 0.33 0.41 0.51
c 0.23 0.28 0.33
D 5.00 5.15 5.30
D1 4.70 4.90 5.10
D2 3.80 4.00 4.20
E 6.00 6.15 6.30
E1 5.70 5.90 6.10
E2 3.45 3.65 3.85
e 1.27 BSC
G 0.51 0.575 0.71
K 1.20 1.35 1.50
L 0.51 0.575 0.71
L1 0.125 REF
M 3.00 3.40 3.80
q 0 _ −−− 12 _
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
3.200
4.530
E2
PIN 5
(EXPOSED PAD)
L1 M
2X
0.905
1
1.330
G D2
BOTTOM VIEW
0.965
4X
1.000
4X 0.750
1.270
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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