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PDF ZSSC3036 Data sheet ( Hoja de datos )

Número de pieza ZSSC3036
Descripción High-Resolution 16-Bit Sensor Signal Conditioner
Fabricantes IDT 
Logotipo IDT Logotipo



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Low-Power, High-Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3036
Datasheet
Brief Description
The ZSSC3036 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3036 can perform offset,
span, and 1st and 2nd order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C™* (3.4MHz) or SPI (20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3036 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3036 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
IDT’s additional ZSSC30x6 products.
Features
Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain as well as of 1st and 2nd order temperature
gain and offset drift
Fast sensing: 16-bit conditioned sensor signal
measurement rate at more than 200s-1
Typical sensor elements can achieve accuracy of
less than ±0.10% FSO** @ -40 to 110°C
Benefits
Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Single-pass calibration minimizes calibration
costs
No external trimming, filter, or buffering com-
ponents required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
–40°C to +110°C
Small die size
Delivery options: die for wafer bonding
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
ZSSC3036 Application Example
© 2016 Integrated Device Technology, Inc.
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April 20, 2016

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ZSSC3036 pdf
ZSSC3036 Datasheet
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 4.2
Status Byte for Read Operations ...................................................................................................25
Status Byte for Write Operations ...................................................................................................25
Mode Status...................................................................................................................................26
Memory Status Word .....................................................................................................................31
MTP Memory Content Assignments ..............................................................................................32
Pad Assignments ...........................................................................................................................44
© 2016 Integrated Device Technology, Inc.
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April 20, 2016

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ZSSC3036 arduino
ZSSC3036 Datasheet
The amplifier consists of two stages with programmable gain values. The 1/f noise and inherent offset are
suppressed by auto-zero and chopper stabilizer techniques. This auto-zero sequence is performed before each
bridge sensor and temperature measurement to compensate for the inherent offset of the amplifier.
The ZSSC3036 employs a 2-stage analog-to-digital converter (ADC) based on switched-capacitor technique with
inherit low-pass behavior and noise suppression. The programmable resolution from 10 to 16 bits provides
flexibility for adapting the conversion characteristics. To improve power supply noise suppression, the ADC uses
the bridge supply VDDB as its reference voltage.
The remaining IC-internal offset and the sensor element offset, i.e., the overall system offset for the amplifier and
ADC, can be canceled by an offset and auto-zero measurement, respectively.
The DSP accomplishes the auto-zero, span, and 1st and 2nd order temperature compensation of the measured
bridge signal. The correction coefficients are stored in the MTP memory.
The ZSSC3036 supports SPI and I2C™ interface communication for controlling the ZSSC3036, configuration, and
measurement result output.
2.3. Analog Front End
2.3.1. Amplifier
The amplifier has a differential architecture and consists of two stages. The amplification of each stage and the
sensor bridge gain polarity are programmable via settings in the Measurement Configuration Register BM_config
(address 10HEX; see section 3.6.3) in the MTP memory (see section 2.4.2).
The first five bits of BM_config are the programmable gain settings Gain_stage1 and Gain_stage2. The options
for the programmable gain settings are listed in Table 2.1 and Table 2.2.
Table 2.1 Amplifier Gain: Stage 1
Gain_stage1
BM_config Bit G1
0
0
1
1
BM_config Bit G0
0
1
0
1
Stage 1 Gain Setting
12
20
30
40
© 2016 Integrated Device Technology, Inc.
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