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PDF HMC572LC5 Data sheet ( Hoja de datos )
| Número de pieza | HMC572LC5 | |
| Descripción | GaAs MMIC I/Q DOWNCONVERTER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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v06.0514
HMC572LC5
GaAs MMIC I/Q DOWNCONVERTER
24 - 28 GHz
Typical Applications
The HMC572LC5 is ideal for:
• Point-to-Point and Point-to-Multi-Point Radio
• Military Radar, EW & ELINT
• Satellite Communications
Functional Diagram
Features
8 dB Conversion Gain
Image Rejection: 18 dB
2 LO to RF Isolation: 35 dB
Noise Figure: 3.5 dB
Input IP3: +5 dBm
32 Lead 5x5mm SMT Package: 25mm²
General Description
The HMC572LC5 is a compact GaAs MMIC I/Q
downconverter in a leadless RoHS compliant
SMT package. This device provides a small signal
conversion gain of 8 dB with a noise figure of 3.5 dB
and 18 dB of image rejection across the frequency
band. The HMC572LC5 utilizes an LNA followed by
an image reject mixer which is driven by an active x2
multiplier. The image reject mixer eliminates the need
for a filter following the LNA, and removes thermal
noise at the image frequency. I and Q mixer outputs
are provided and an external 90° hybrid is needed to
select the required sideband. The HMC572LC5 is a
much smaller alternative to hybrid style image reject
mixer downconverter assemblies, and it eliminates the
need for wire bonding by allowing the use of surface
mount manufacturing techniques.
Electrical Specifications, TA = +25 °C, IF = 100 MHz, LO = +4 dBm, Vdd = 3.5 Vdc*
Parameter
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Gain (As IRM)
Noise Figure
Image Rejection
1 dB Compression (Input)
2 LO to RF Isolation
2 LO to IF Isolation
IP3 (Input)
Amplitude Balance
Phase Balance
Total Supply Current
*Data taken as IRM with external IF Hybrid
Min.
6.0
14
-6
32
30
+5
Typ.
24.5 - 26.5
9 - 15.5
DC - 3.5
8.0
3.5
17
-4
35
40
+8
0.3
5
125
Max.
165
Min. Typ. Max.
23 - 28
9 - 15.5
DC - 3.5
6 10
3.5
14 20
-7 -5
30 35
25 40
+3 +6
0.4
8
125 165
Units
GHz
GHz
GHz
dB
dB
dB
dBm
dB
dB
dBm
dB
Deg
mA
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1 page  
Outline Drawing
v06.0514
HMC572LC5
GaAs MMIC I/Q DOWNCONVERTER
24 - 28 GHz
NOTES:
1.. PACKAGE BODY MATERIAL: ALUMINA
2.. LEAD AND GROUND PADDLE PLATING: 30 - 80 MICROINCHES
GOLD OVER 50 MICROINCHES MINIMUM NICKLE
3.. DIMENSIONS ARE IN INCHES [MILLIMETERS]
4.. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5.. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM
6.. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND
Package Information
Part Number
Package Body Material
HMC572LC5
Alumina, White
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
Gold over Nickel
MSL Rating
MSL3 [1]
Package Marking [2]
H572
XXXX
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5 Page | ||
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| PDF Descargar | [ Datasheet HMC572LC5.PDF ] | |
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