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PDF HMC966LP4E Data sheet ( Hoja de datos )

Número de pieza HMC966LP4E
Descripción GaAs MMIC I/Q DOWNCONVERTER
Fabricantes Analog Devices 
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HMC966LP4E
v03.1012
GaAs MMIC I/Q DOWNCONVERTER
17 - 20 GHz
Typical Applications
The HMC966LP4E is ideal for:
• Point-to-Point and Point-to-Multi-Point Radio
• Military Radar, EW & ELINT
• Satellite Communications
Functional Diagram
Features
Conversion Gain: 14 dB
Image Rejection: 40 dBc
2 LO to RF Isolation: 40 dB
Noise Figure: 2.5 dB
Input IP3: 0 dBm
24 Lead 4X4 mm SMT Package: 16mm²
General Description
The HMC966LP4E is a compact GaAs MMIC I/Q
downconverter in a leadless RoHS compliant
SMT package. This device provides a small signal
conversion gain of 14 dB with a noise figure of 2.5 dB
and 40 dBc of image rejection across the frequency
band. The HMC966LP4E utilizes an LNA followed by
an image reject mixer which is driven by an active x2
multiplier. The image reject mixer eliminates the need
for a filter following the LNA, and removes thermal
noise at the image frequency. I and Q mixer outputs
are provided and an external 90° hybrid is needed to
select the required sideband. The HMC966LP4E is a
much smaller alternative to hybrid style image reject
mixer downconverter assemblies, and is compatible
with surface mount manufacturing techniques.
Electrical Specifications, TA = +25 °C, IF = 1000 MHz, LO = +6 dBm, Vdd = 3.5 Vdc LSB [1]
Parameter
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Gain (As IRM)
Noise Figure
Image Rejection
1 dB Compression (Input)
2 LO to RF Isolation
2 LO to IF Isolation
IP3 (Input)
Amplitude Balance [2]
Phase Balance [2]
Total Supply Current
[1] Data taken as IRM with external IF 90° Hybrid
[2] Data taken without external 90° hybrid, IF = 1000 MHz
Min.
Typ.
Max.
Units
17 - 20
7.5 - 11.75
GHz
GHz
DC - 3.5
10 14
GHz
dB
2.5 3.5 dB
15 40
dBc
-9
38 47
dBm
dB
9 14
-2 0
dB
dBm
0.5 dB
17 deg
160 200 mA
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HMC966LP4E pdf
v03.1012
HMC966LP4E
GaAs MMIC I/Q DOWNCONVERTER
17 - 20 GHz
Quadrature Channel Data Taken Without IF 90° Hybrid, IF = 1000 MHz
IF Bandwidth [1]
Amplitude Balance vs. LO Drive [2]
20
15
10
5
0
RETURN LOSS
CONVERSION GAIN
-5
-10
-15
-20
0.5 1 1.5 2 2.5 3 3.5 4
IF FREQUENCY (GHz)
2
1.5
1
0.5
0
-0.5
-1
-1.5
-2
17
LO = +2 dBm
LO = +4 dBm
LO = +6 dBm
18 19
RF FREQUENCY (GHz)
20
Phase Balance vs. LO Drive [2]
40
35 LO = +2 dBm
LO = +4 dBm
30 LO = +6 dBm
25
20
15
10
5
0
17 18 19 20
RF FREQUENCY (GHz)
[1] Data taken with LO frequency fixed at 6.5 GHz and RF varied.
[2] Data taken with IF = 1000 MHz
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HMC966LP4E arduino
v03.1012
HMC966LP4E
GaAs MMIC I/Q DOWNCONVERTER
17 - 20 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
x
-12.5
4.6
-18.7
-26.0
1
-10.7
-16.3
0
-16.7
-16
2
-53.4
-67.7
-42.1
-41.5
-39.9
3
x
-99.2
-82.9
-81.8
-73
4
x
x
x
-104.5
-99.1
RF = 18 GHz @ -20 dBm
LO = 8.5 GHz @ +4 dBm
Data taken without IF hybrid
All values in dBc below IF power level (1RF -2LO = 1 GHz)
Outline Drawing
Absolute Maximum Ratings
RF
LO Drive
Vdd
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 16.4 mW/°C above 85°C)
Thermal Resistance (RTH)
(channel to package bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+2 dBm
+10 dBm
4V
175 °C
1.48 W
60.7 °C/W
-65 to +150 °C
-55 to +85 °C
Class 0
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Package Information
Part Number
Package Body Material
HMC966LP4E RoHS-compliant Low Stress Injection Molded Plastic
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260 °C
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15 mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05 mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm.
6. ALL GROUND LEADS AND GROUND PADDLE
MUST BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR
SUGGESTED LAND PATTERN.
Lead Finish
100% matte Sn
MSL Rating
MSL1 [2]
Package Marking [1]
H966
XXXX
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