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PDF HMC434E Data sheet ( Hoja de datos )
| Número de pieza | HMC434E | |
| Descripción | SMT GaAs HBT MMIC | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC434E (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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v04.0410
Typical Applications
4 Prescaler for DC to C Band PLL Applications:
• UNII, Pt. - Pt. & VSAT Radios
• 802.11a & HiperLAN WLAN
• Fiber Optic
• Cellular / 3G Infrastructure
Functional Diagram
HMC434 / 434E
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8 GHz
Features
Ultra Low SSB Phase Noise: -150 dBc/Hz
Single-Ended I/O’s
Output Power: -2 dBm
Single DC Supply: +3V @ 62 mA
9 mm2 Ultra Small Package: SOT26
General Description
The HMC434(E) is a low noise Divide-by-8 Static
Divider utilizing InGaP GaAs HBT technology in
ultra small surface mount SOT26 plastic packages.
This device operates from DC (with a square wave
input) to 8 GHz input frequency with a single +3V
DC supply. Single-ended inputs and outputs reduce
component count and cost. The low additive SSB
phase noise of -150 dBc/Hz at 100 kHz offset helps
the user maintain good system noise performance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= +3V
Parameter
Conditions
Maximum Input Frequency
Minimum Input Frequency
Sine Wave Input. [1]
Input Power Range
Fin= 1 to 3 GHz
Fin= 3 to 7 GHz
Fin= 7 to 8 Ghz
Output Power
Fin= 1 to 8 GHz
Reverse Leakage
RF Output Terminated, Fin= 4 GHz, Pin= 0 dBm
SSB Phase Noise (100 kHz offset)
Pin= 0 dBm, Fin= 4 GHz
Output Transition Time
Pin= 0 dBm, Fout= 882 MHz
Supply Current (Icc)
Vcc= +3.0V
1. Divider will operate down to DC for square-wave input signal.
Min.
8
-10
-3
0
-5.0
Typ. Max.
8.5
0.2
+12
+12
+10
-2.0
-20
-150
140
62 83
Units
GHz
GHz
dBm
dBm
dBm
dBm
dBm
dBc/Hz
ps
mA
4 - 78
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1 page  
v04.0410
Outline Drawing
HMC434 / 434E
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8 GHz
4
Package Information
Part Number
Package Body Material
HMC434
Low Stress Injection Molded Plastic
HMC434E
RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
LAND PATTERN.
Lead Finish
Sn/Pb Solder
100% matte Sn
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H434
XXXX
434E
XXXX
Pin Description
Pin Number
Function
1, 4 N/C
2 GND
Description
The pins are not connected internally; however, all
data shown herein was measured with these pins
connected to RF/DC ground externally.
Pin must connect ro RF/DC ground.
Interface Schematic
3 IN
RF input must be DC blocked.
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4 - 81
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet HMC434E.PDF ] | |
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