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PDF HMC447LC3 Data sheet ( Hoja de datos )
| Número de pieza | HMC447LC3 | |
| Descripción | SMT GaAs HBT MMIC | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC447LC3 (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
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v04.0514
Typical Applications
Prescaler for 10 to 26 GHz PLL Applications:
• Point-to-Point / Multi-Point Radios
• VSAT Radios
• Fiber Optic
• Test Equipment
• Military
Functional Diagram
HMC447LC3
SMT GaAs HBT MMIC
DIVIDE-BY-4, 10 - 26 GHz
Features
Very Wide Bandwidth
Ultra Low SSB Phase Noise: -150 dBc/Hz
Output Power: -4 dBm
Single DC Supply: +5V
RoHS Compliant 3x3 mm SMT Package
General Description
The HMC447LC3 is a low noise Divide-by-4
Regenerative Divider utilizing InGaP GaAs HBT
technology. This wideband divider operates with input
frequencies from 10 to 26 GHz, and accepts a very wide
range of input power levels. THe HMC447LC3 exhibits
a very low SSB Phase Noise of -150 dBc/Hz at 100 kHz
offset, making it ideal for use in high frequency Phase
Locked Loops (PLL), and in Local Oscillator (LO)
distribution applications where fundamental and
divided LO frequencies are required within a
system. This versatile divider consumes only 96 mA
from a single positive supply of +5V, and delivers
very flat output power across the rated bandwidth.
The HMC447LC3 is housed in a RoHS compliant,
3x3 mm leadless SMT package with an exposed
ground paddle.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= +5V
Parameter
Maximum Input Frequency
Minimum Input Frequency
Input Power Range
Output Power
Reverse Leakage
SSB Phase Noise (100 kHz offset)
Output Transition Time
Supply Current (Icc1 + Icc2)
Conditions
Fin = 10 to 14 GHz
Fin = 14 to 18 GHz
Fin = 18 to 20 GHz
Fin = 20 to 22 GHz
Fin = 22 to 26 GHz
Fin = 10 to 26 GHz
RF Output Terminated
Pin = 0 dBm, Fin = 22 GHz
Pin = 0 dBm, Fout = 4500 MHz
Min.
26
-15
-15
-10
-5
0
-7
Typ.
27
9
-20
-20
-15
-10
-5
-4
50
-150
100
96
Max.
10
+10
+5
+10
+10
+10
Units
GHz
GHz
dBm
dBm
dBm
dBm
dBm
dBm
dB
dBc/Hz
ps
mA
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1 page  
v04.0514
Outline Drawing
HMC447LC3
SMT GaAs HBT MMIC
DIVIDE-BY-4, 10 - 26 GHz
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES
GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS]
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- .
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC447LC3
Alumina, White
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
Gold over Nickel
MSL Rating
MSL3 [1]
Package Marking [2]
H447
XXXX
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4
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet HMC447LC3.PDF ] | |
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