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PDF AD8398A Data sheet ( Hoja de datos )
| Número de pieza | AD8398A | |
| Descripción | Single Port VDSL2 Line Driver | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de AD8398A (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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Single Port VDSL2
Line Driver with Shutdown
AD8398A
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Voltage feedback
Wide output swing
18.4 V p-p differential, RLOAD, DIFF = 20 Ω from 12 V supply
High output current
Linear output current of 450 mA peak
Low distortion
−65 dBc for Profile 8b @ 20.4 dBm
−55 dBc for Profile 17a @ 14.5 dBm
High speed
85 MHz bandwidth (AV DIFF = 5)
APPLICATIONS
NC 1
−IN A 2
+IN A 3
GND 4
–
+
12 NC
– 11 −IN B
+ 10 +IN B
9 PD1
NC = NO CONNECT
Figure 1. Thermally Enhanced, 4 mm × 4 mm, 16-Lead LFCSP_WQ
ADSL2+/VDSL2 CO/CPE line drivers
PLC line drivers
TYPICAL APPLICATION DIAGRAM
Consumer xDSL modems
Twisted pair line drivers
1/2 TIP
www.BDTIC.com/cn/adiVMID*
AD8398A
1/2 RING
AD8398A
GENERAL DESCRIPTION
The AD8398A comprises two high speed, voltage feedback
operational amplifiers. When configured as a differential line
driver, the AD8398A is an ideal choice for ADSL2+, VDSL2, and
power line communications (PLC) applications. It has high
output current, high bandwidth, and fast slew rate, combined
with exceptional multitone power ratio (MTPR) and common-
mode stability. The AD8398A is available in a thermally enhanced
4 mm × 4 mm, 16-lead LFCSP.
*VMID =
VCC + VEE
2
Figure 2. Typical VDSL2 Application
The AD8398A incorporates power management functionality
via two CMOS-compatible control pins, PD0 and PD1. These
pins select one of four operating modes: full power, medium
power, low power, or complete power-down. In the power-down
mode, the quiescent current drops to 0.7 mA.
The AD8398A operates in the industrial temperature range of
−40°C to +85°C.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2008–2010 Analog Devices, Inc. All rights reserved.
1 page  
AD8398A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Power Supplies (VCC − VEE)
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Rating
13.2 V
(TJ MAX − TA)/θJA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8398A is limited
by its junction temperature (TJ) on the die. The maximum safe
TJ of plastic encapsulated devices, as determined by the glass
transition temperature of the plastic, is 150°C. Temporarily
exceeding this limit may cause a shift in the parametric
performance due to a change in the stresses exerted on the
die by the package. Exceeding this limit for an extended period
can result in device failure.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP_WQ
on a 4-layer board with six vias connecting the exposed pad to
the GND plane layer.
6
TJ = 150°C
THERMAL RESISTANCE
5
θJA is specified with the device soldered on a JEDEC circuit
4
board and the thermal pad connected to the GND plane layer
using six vias.
Table 3. Thermal Resistance
Package Type
www.BDTIC.com/cn/adi16-LeadLFCSP_WQ
θJA
35.6
Unit
°C/W
3
2
1
0
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature,
4-Layer JEDEC Board with Six Thermal Vias
ESD CAUTION
Rev. D | Page 4 of 12
5 Page 
AD8398A
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.65
BSC
0.45
0.40
0.35
0.35
0.30
0.25
13
12
16
EXPOSED
PAD
1
9
8 54
BOTTOM VIEW
PIN 1
INDICATOR
2.40
2.35 SQ
2.30
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD
Figure 16. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
www.BDTIC.com/cn/adiAD8398AACPZ-R2 −40°Cto+85°C
Package Description
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Package Option
CP-16-20
AD8398AACPZ-R7 −40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-16-20
AD8398AACPZ-RL
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-16-20
1 Z = RoHS Compliant Part.
Rev. D | Page 10 of 12
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet AD8398A.PDF ] | |
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